Substrate processing system, carrying device, and coating device

ABSTRACT

A substrate processing system includes a processing unit, a substrate loading unit, a substrate unloading unit, and a carrying unit. A carrying device has a constitution in which a suction portion suctioning and holding a substrate is rotatable about an arm portion provided in a base portion and the substrate is rotated in the state where the substrate is held by a holding portion. A coating device has a constitution in which a liquid material is ejected from a nozzle to both surfaces of the substrate rotating in an upright state.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continuation-in-part application of U.S. application Ser. No.12/547,270, filed on Aug. 25, 2009, which is based upon and claims thebenefit of priority from Japanese Patent Application No. 2008-219561,filed on Aug. 28, 2008, Japanese Patent Application No. 2008-219562,filed on Aug. 28, 2008, Japanese Patent Application No. 2008-219563,filed on Aug. 28, 2008, and Japanese Patent Application No. 2009-143632,filed on Jun. 16, 2009. The contents of the aforementioned applicationsare incorporated herein in their entirety by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a substrate processing system, acarrying device, and a coating device.

2. Description of the Related Art

For example, upon coating a thin film such as a resist film on varioussubstrates such as a semiconductor substrate, a glass substrate forminga liquid crystal panel, and a substrate forming a hard disk, a coatingdevice is used to form the coating film on the substrate while rotatingthe substrate (for example, see Patent Reference 1).

The coating device may be used as, for example, a coating unit mountedto a substrate processing system for performing a substrate loadingoperation, a substrate coating operation, and a substrate unloadingoperation.

The substrate processing system includes units for performing the mainoperations. For example, in the above-described example, a substrateloading unit for performing the loading operation and a substrateunloading unit for performing the unloading operation are mounted to thesubstrate processing system. In the case where the substrate is carriedbetween plural units, in general, a carrying device is provided for eachunit so as to deliver the substrate or a cassette accommodating thesubstrate between the carrying devices.

Next, the coating device is equipped with a rotary mechanism whichrotates the substrate. The rotary mechanism is capable of rotating thesubstrate by absorbing and holding the substrate.

When the substrate is held by, for example, the rotary mechanism, inmany cases, the substrate is carried by the carrying device from outsideto the rotary mechanism. As the carrying device, a carrying devicehaving a substrate holding portion provided in a front end of an arm,for example, is known. As the substrate holding portion provided in thecarrying device, a substrate holding portion having an absorbing portionfor absorbing the substrate, for example, is known. The carrying devicecarries the substrate up to the coating device, and delivers thesubstrate to the rotary mechanism of the coating device.

Next, in the coating device, in general, the substrate is laid down soas to be parallel to a horizontal plane and the substrate is rotatedwhile the lower substrate surface is held.

Meanwhile, in the substrate used to form the hard disk, for example, itis necessary to coat the liquid material on both surfaces thereof. Inthe case of this kind of substrate of which both surfaces are requiredto be coated with the liquid material, it is not possible to hold thelower substrate surface. For this reason, Patent Reference 1, forexample, discloses a technology in which the substrate is rotated whilethe substrate is held by a holding piece.

[Patent Reference 1]

Japanese Unexamined Patent Application, First Publication No. Hei7-130642

SUMMARY OF THE INVENTION

However, in the substrate processing system in which plural carryingdevices are used for the carrying operation between the units, theconstitution or control settings related to the arrangement of thecarrying devices, the delivery control timing, and the like tend to becomplicated. For this reason, a problem arises in that the overallsystem constitution is complicated and the process tact time is long.

In consideration of the above-described circumstance, a first object ofthe invention is to provide a substrate processing system capable ofreducing the process tact time by simplifying the system constitutionthereof.

Next, in the case where the substrate is delivered between the carryingdevice and the coating device, for example, a positioning operation ofthe substrate may be required or the substrate may be absorbed and heldby the rotary mechanism again when an absorbing operation using thesubstrate holding portion is canceled. In this case, it takes time toperform such operations. For this reason, the process tact time requiredfor one sheet of a substrate becomes long, and thus a problem arises inthat it is difficult to improve throughput. This problem may arise inthe case of performing other processes of rotating the substrate as wellas in the case of forming a thin film on the substrate.

In consideration of the above-described circumstance, a second object ofthe invention is to provide a carrying device capable of improvingthroughput by reducing process tact time.

Next, according to the method disclosed in the Patent Reference 1, sincethe liquid material is coated on both surfaces of the substrate when thesubstrate is laid down, the coating conditions between the front andrear surfaces of the substrate are different. For this reason, the stateof the thin film formed on the front surface of the substrate may bedifferent from the state of the thin film formed on the rear surfacethereof.

In consideration of the above-described circumstance, a third object ofthe invention is to provide a coating device capable of improving thestate of the liquid material coated on the substrate.

According to a first aspect of the invention, there is provided asubstrate processing system including: a processing unit which performsa predetermined process on a substrate; a substrate loading unit whichsupplies a loading container accommodating the substrate not subjectedto the predetermined process and collects the empty loading container; asubstrate unloading unit which collects an unloading containeraccommodating the substrate subjected to the predetermined process andsupplies the empty unloading container; and a carrying unit whichincludes a carrying mechanism for carrying the loading container betweenthe substrate loading unit and a loading position inside the processingunit and carrying the unloading container between the substrateunloading unit and an unloading position inside the processing unit.

According to this aspect, since the carrying mechanism provided in thecarrying unit carries the loading container between the substrateloading unit and the loading position inside the processing unit andcarries the unloading container between the substrate unloading unit andthe unloading position inside the processing unit, the carryingoperation in different carrying areas can be performed by one carryingmechanism. Accordingly, since the carrying process using the carryingmechanism can be unified, it is possible to simplify the systemconstitution, and to reduce the process tact time. In addition,according to this aspect, since the loading container and the unloadingcontainer are separately used, it is advantageous in that it is possibleto prevent the substrate from being contaminated.

In the substrate processing system, the processing unit, the substrateloading unit, and the substrate unloading unit may be arranged in alinear direction.

In this case, since the processing unit, the substrate loading unit, andthe substrate unloading unit are arranged in a linear direction, thecarrying path between the units can be set in the linear direction.Accordingly, it is possible to prevent the carrying path from beingcomplicated, and thus to simplify the system constitution.

In the substrate processing system, the processing unit may be disposedbetween the substrate loading unit and the substrate unloading unit.

In this case, since the processing unit is disposed between thesubstrate loading unit and the substrate unloading unit, the respectiveunits are arranged in a direction along the stream of the substrate.Accordingly, it is possible to improve the efficiency of the process.

In the substrate processing system, the carrying unit may include amoving mechanism which moves the carrying mechanism in a lineardirection.

In this case, since the carrying unit includes the moving mechanismwhich moves the carrying mechanism in a linear direction, it is possibleto simplify the moving operation of the carrying mechanism. Accordingly,it is possible to simplify the system constitution.

In the substrate processing system, the substrate loading unit and thesubstrate unloading unit may be respectively provided with a pluralityof container standby portions.

In this case, since the substrate loading unit and the substrateunloading unit are respectively provided with the plurality of containerstandby portions, it is possible to promptly process more substrates.

In the substrate processing system, at least one of the substrateloading unit and the substrate unloading unit may include a secondmoving mechanism which moves the plurality of container standbyportions.

In this case, since at least one of the substrate loading unit and thesubstrate unloading unit includes the second moving mechanism whichmoves the plurality of container standby portions, it is possible tomove the container standby portions closer to a the carrying unit.Accordingly, it is possible to promptly perform the carrying operation,and thus to improve the efficiency of the process.

In the substrate processing system, the second moving mechanism may movethe container standby portions so that a supply target container movescloser to the carrying unit and a collection target container moves awayfrom the carrying unit.

In this case, since the second moving mechanism moves the containerstandby portions so that the supply target container moves closer to thecarrying unit and the collection target container moves away from thecarrying unit, it is possible to further promptly perform the supplyoperation of the supply target container and the collection operation ofthe collection target container. Accordingly, it is possible to improvethe efficiency of the process.

In the substrate processing system, the processing unit may be providedwith a buffer mechanism which includes a plurality of second containerstandby portions corresponding to at least one of the loading positionand the unloading position.

In this case, since the processing unit is provided with the buffermechanism which includes the plurality of second container standbyportions corresponding to at least one of the loading position and theunloading position, it is possible to promptly perform the loadingoperation and the unloading operation of the substrate in the processingunit. Accordingly, it is possible to improve the efficiency of theprocess.

In the substrate processing system, the buffer mechanism may include athird moving mechanism which moves the plurality of second containerstandby portions.

In this case, since the buffer mechanism includes the third movingmechanism which moves the plurality of second container standbyportions, it is possible to move the second container standby portionsin accordance with the number of the substrates remaining in thecontainer. Accordingly, it is possible to improve the efficiency of theprocess.

In the substrate processing system, the third moving mechanism may movethe second container standby portions in the same direction as thecarrying mechanism.

In this case, since the third moving mechanism moves the secondcontainer standby portions in the same direction as the carryingmechanism, the second container standby portions move in the carryingdirection. For this reason, the distance between the carrying mechanismand each second container standby portion is maintained to be uniform.Since the distance is maintained to be uniform, it is possible touniformly perform the carrying operation between the carrying mechanismand each second container standby portion. Accordingly, it is possibleto prevent the carrying operation from being complicated.

In the substrate processing system, the processing unit may include apickup mechanism which lifts the substrate from the loading containerand disposes the substrate at the loading position.

In this case, since the processing unit includes the pickup mechanismwhich lifts the substrate from the loading container and disposes thesubstrate at the loading position, it is possible to promptly performthe loading operation of the substrate.

In the substrate processing system, the carrying unit may include arotary mechanism which rotates the orientation of the carryingmechanism.

In this case, since the carrying unit includes the rotary mechanismwhich rotates the direction of the carrying mechanism, even when thecarrying direction is different from the direction of the container, itis possible to smoothly perform the carrying operation and the deliveryoperation.

In the substrate processing system, each of the loading container andthe unloading container may be provided with an engagement portion, andthe carrying mechanism may include a holding member which engages withthe engagement portion so as to hold the loading container or theunloading container.

In this case, since each of the loading container and the unloadingcontainer is provided with the engagement portion, and the carryingmechanism includes the holding member which engages with the engagementportion so as to hold the loading container or the unloading container,it is possible to reliably hold the loading container and the unloadingcontainer.

The substrate processing system may further include a control devicewhich controls a carrying position of at least one of the loadingcontainer and the unloading container in accordance with a processingstate of the substrate in the processing unit.

In this case, since the carrying position of at least one of the loadingcontainer and the unloading container is controlled in accordance withthe processing state of the substrate in the processing unit, it ispossible to further efficiently perform the carrying operation.

In the substrate processing system, the predetermined process mayinclude a coating process of coating a liquid material on the substrate,a pre-process of the coating process, and a post-process of the coatingprocess.

In this case, since the predetermined process includes the coatingprocess of coating the liquid material on the substrate, the pre-processof the coating process, and the post-process of the coating process, itis possible to simplify the system constitution in the steps before andafter the coating process.

In the substrate processing system, the pre-process may include at leastone of a process of irradiating ultraviolet ray to the substrate and aprocess of cleaning the substrate.

In this case, since the process is performed in a wide range such thatthe pre-process includes at least one of the process of irradiatingultraviolet ray to the substrate and the process of cleaning thesubstrate, it is possible to simplify the process system.

In the substrate processing system, the post-process may include atleast one of a process of depressurizing the vicinity of the substrateand a process of heating the substrate.

In this case, since the process is performed in a wide range such thatthe post-process includes at least one of the process of depressurizingthe vicinity of the substrate and the process of heating the substrate,it is possible to simplify the process system.

The substrate processing system may further include a foreign materialdetecting unit which detects a foreign material existing on thesubstrate subjected to the predetermined process.

When a foreign material is adhered to the substrate subjected to thepredetermined process, the foreign material adhered portion of thesubstrate may be damaged in accordance with the next process.Accordingly, in this case, since the substrate processing system furtherincludes the foreign material detecting unit which detects a foreignmaterial existing on the substrate subjected to the predeterminedprocess, it is possible to prevent the substrate attached with theforeign material from being used for the next process, and thus toprevent the substrate from being damaged.

According to a second aspect of the invention, there is provided acarrying device which carries a substrate between a substrate loadingarea, a substrate unloading area, and a substrate processing area, thecarrying device including: an arm portion which is provided on a baseportion; and a suction portion which is rotatably provided in the armportion so as to suction and hold the substrate.

According to this aspect, since the suction portion is rotatablyprovided in the arm portion so as to suction and hold the substrate, itis possible to rotate the substrate while the substrate is held by theholding portion. For this reason, even when the substrate is rotated inthe substrate processing area, it is not necessary to deliver thesubstrate to a rotary mechanism or the like. Since the operation ofdelivering the substrate is not performed, it is possible to promptlyperform a process from the substrate carrying operation to the substrateprocessing operation. Accordingly, it is possible to reduce the processtact time, and thus to improve throughput.

In the carrying device, the substrate may be a substrate provided withan opening, and the suction portion may include a suction hole whichsuctions a surface of the substrate along the opening.

In this case, since the suction hole suctions the surface of thesubstrate along the opening when the substrate having the opening isprocessed, a wide area from the outer periphery of the substrate to theportion suctioned by the suction hole is set to a process target.

In the carrying device, the suction hole may be disposed so as tosuction an unprocessed portion of the substrate.

In this case, since the suction hole is disposed so as to suction theunprocessed portion of the substrate, it is possible to suction thesubstrate without having an influence on the processed portion of thesubstrate.

In the carrying device, the suction portion may include a protrusionwhich is fitted into the opening.

In this case, since the suction portion includes the protrusion which isfitted into the opening, at least a part of the opening is blocked bythe protrusion. Accordingly, upon suctioning the substrate, it ispossible to suction the substrate without reducing the suctioning forceeven when the area including the opening is suctioned, and thus tofurther reliably hold the substrate.

In the carrying device, the protrusion may be provided so as to beseparable from other portions of the suction portion.

In this case, since the protrusion is provided so as to be separablefrom other portions of the suction portion, for example, when theprotrusion is not necessary, it is possible to separate the protrusionfrom other portions of the suction portion. In addition, since, forexample, plural protrusions having different dimensions may be used foreach case, it is possible to handle the case where the substrateprovided with an opening having a different dimension is processed.Accordingly, it is possible to variously change the type of suctioningand holding of the substrate.

In the carrying device, a protrusion amount of the protrusion may be notmore than the thickness of the substrate.

In this case, since the protrusion amount of the protrusion is not morethan the thickness of the substrate, it is possible to prevent theprotrusion from protruding to the opposite side of the absorbing surfaceof the substrate. Accordingly, it is easy to dispose other members onthe opposite side of the absorbing surface of the substrate.

In the carrying device, the arm portion may be equipped with a drivingportion which rotates the suction portion.

In this case, since the arm portion is equipped with the driving portionwhich rotates the suction portion, it is possible to further simplifythe constitution of the device.

The carrying device may further include an external driving portionwhich rotates the substrate with the substrate interposed between itselfand the suction portion.

In this case, since the substrate is rotated with the substrateinterposed between the external driving portion and the suction portion,it is possible to rotate the substrate in the state where the substrateis held even when the driving mechanism is not provided in the armportion. For this reason, since it is possible to realize a decrease insize of the arm portion and to simplify the constitution thereof, it ispossible to minimize the load required for the carrying operation.

In the carrying device, the external driving portion may be provided inthe substrate processing area.

In this case, since the external driving portion is provided in thesubstrate processing area, it is possible to perform the substrateprocessing operation and the substrate rotating operation in aninterlocking manner. Accordingly, it is possible to improve theefficiency of the process.

In the carrying device, the external driving portion may include apressing portion which presses the substrate, and the pressing portionmay be formed so as to correspond to the suction portion.

In this case, since the external driving portion includes the pressingportion which presses the substrate, and the pressing portion is formedso as to correspond to the suction portion, a suctioning force isapplied to the substrate using the suction portion and the pressingforce using the pressing portion, where the suctioning force and thepressing force correspond to each other. Accordingly, it is possible toreliably hold the substrate.

In the carrying device, the arm portion may include a shaft portionwhich is rotatable about the base portion and is movable in a telescopicmanner in a direction of a rotary axis of the rotation; and a telescopicportion which is provided in the shaft portion and is movable in atelescopic manner in a direction perpendicular to the direction of therotary axis, and the suction portion may be provided in a front end ofthe telescopic portion.

In this case, since it is possible to rotate the arm portion about thebase portion and to move the arm portion in a telescopic manner in thedirection of the rotary axis of the rotation. Also, it is possible tomove the arm portion in a telescopic manner in a direction perpendicularto the direction of the rotary axis. For this reason, it is possible tomove the suction portion provided in the front end of the telescopicportion in a wide range.

In the carrying device, the external driving portion may include apressing portion which presses the substrate, and the pressing portionmay be formed so as to correspond to the suction portion.

In this case, since the external driving portion includes the pressingportion which presses the substrate, and the pressing portion is formedso as to correspond to the suction portion, it is possible to reliablyhold the substrate by the pressing operation using the pressing portionand the suctioning operation using the suction portion.

In the carrying device, the external driving portion may allow thepressing portion to press the substrate when the substrate is disposedat a substrate processing position of the substrate processing area.

In this case, since the external driving portion allows the pressingportion to press the substrate when the substrate is disposed at thesubstrate processing position of the substrate processing area, it ispossible to reliably hold the substrate from the time when the substrateis disposed.

The carrying device may further include a control portion which changesa suctioning state of the suction portion when the substrate is rotatedby the external driving portion.

In this case, since the carrying device further includes the controlportion which changes the suctioning state of the suction portion whenthe substrate is rotated by the external driving portion, it is possibleto adjust the force of holding the substrate pressed by the pressingportion by controlling the suctioning state of the suction portion.

In the carrying device, the control portion may cancel the suctioningoperation using the suction portion before the substrate is rotated bythe external driving portion.

In this case, since the control portion cancels the suctioning operationusing the suction portion before the substrate is rotated by theexternal driving portion, it is possible to efficiently perform thesubstrate rotating operation.

In the carrying device, the control portion may cancel the suctioningoperation using the suction portion during the time when the substrateis rotated by the external driving portion.

In this case, since the control portion cancels the suctioning operationusing the suction portion during the time when the substrate is rotatedby the external driving portion, it is possible to efficiently performthe substrate rotating operation.

In the carrying device, the control portion may cancel the suctioningoperation in accordance with the rotation state of the substrate.

In this case, since the control portion cancels the suctioning operationin accordance with the rotation state of the substrate, it is possibleto perform a flexible control in accordance with the rotation state ofthe substrate.

In the carrying device, the control portion may cancel the suctioningoperation using the suction portion after a predetermined process isperformed on the substrate.

In this case, since the control portion cancels the suctioning operationusing the suction portion after the predetermined process is performedon the substrate, it is possible to reliably hold the substrate duringthe predetermined process.

In the carrying device, the external driving portion may rotate thesubstrate even after the predetermined process.

In this case, since the external driving portion rotates the substrateeven after the predetermined process, it is possible to prevent thesubstrate from suddenly stopping after the predetermined process.

According to a third aspect of the invention, there is provided acoating device including: a rotary mechanism which rotates a substratein an upright state; and a coating mechanism which includes nozzles forejecting a liquid material onto front and rear surfaces of the substratewhile rotating the substrate.

According to this aspect, since it is possible to eject the liquidmaterial from the nozzle to both surfaces of the substrate rotating inan upright state, it is possible to allow the liquid material coatingconditions at the front and rear surfaces of the substrate to be moresimilar to each other. According to this aspect, since the liquidmaterial is ejected from a position closer to the substrate so as to becoated on the front and rear surfaces of the substrate, it is possibleto prevent a difference in the state of the thin film of the liquidmaterial formed on the substrate. Accordingly, it is possible to improvethe state of the liquid material coated on the substrate.

In the coating device, the rotary mechanism may rotate the substrate inthe state where the substrate is upright at an angle equal to or morethan 70° and equal to or less than 90° with respect to a horizontalplane.

In this case, since the rotary mechanism rotates the substrate in thestate where the substrate is upright at an angle equal to or more than70° and equal to or less than 90° with respect to a horizontal plane, itis possible to prevent a large difference between the front and rearsurfaces of the substrate. Accordingly, it is possible to uniformly coatthe liquid material on both surfaces of the substrate.

In the coating device, each nozzle may be configured to eject the liquidmaterial from the center of the substrate to the outer peripherythereof.

In this case, since the nozzle is configured to eject the liquidmaterial from the center of the substrate to the outer peripherythereof, the ejecting direction of the nozzle is equal to the directionof the centrifugal force acting on the substrate. Accordingly, it ispossible to further reliably coat the liquid material on the substrate.

In the coating device, each nozzle may be bent from the center thereofto the outer periphery thereof.

In this case, since the nozzle is bent from the center thereof to theouter periphery thereof, it is possible to adjust the liquid materialejecting direction with a simple constitution without providing aseparate adjusting mechanism for adjusting the liquid material ejectingdirection.

In the coating device, an ejecting surface of a front end of each nozzlemay be inclined with respect to a liquid material ejecting direction.

In this case, since the ejecting surface of the front end of the nozzleis inclined with respect to the liquid material ejecting direction, itis possible to reduce the surface tension of the liquid material at thefront end of the nozzle.

Accordingly, since the liquid material smoothly stops upon stopping thecoating operation using the liquid material, very little of the liquidmaterial remains in the front end of the nozzle.

In the coating device, the nozzles may be provided below a rotary shaftof the rotary mechanism.

In this case, since the nozzle is provided below the rotary shaft of therotary mechanism, the liquid material ejecting direction is equal to thedirection of the gravity. Accordingly, the liquid material easilyspreads on the substrate.

In the coating device, the nozzles may be disposed at the same positionson the front and rear surfaces of the substrate.

In this case, since the nozzles are disposed at the same positions onthe front and rear surfaces of the substrate, it is possible for thecoating conditions at the front and rear surfaces of the substrate to beequal to each other.

Accordingly, it is possible to uniformly coat the liquid material onboth surfaces of the substrate.

In the coating device, the coating mechanism may include a movingmechanism which moves the nozzles.

In this case, since the coating mechanism includes the moving mechanismwhich moves the nozzles, it is possible to move the nozzles inaccordance with the processing state of the device. Accordingly, it ispossible to perform the process in a wider range.

The coating device may further include a nozzle managing mechanism whichmanages a nozzle state.

In this case, since the coating device further includes the nozzlemanaging mechanism which manages the nozzle state, it is possible tomaintain the nozzle state to be uniform. Accordingly, it is possible tomaintain the ejecting performance of the nozzle.

In the coating device, the nozzle managing mechanism may include acleaning portion which cleans the front end of each nozzle by dippingthe front end in a cleaning liquid.

In this case, since the nozzle managing mechanism includes the cleaningportion which cleans the front end of each nozzle by dipping the frontend in the cleaning liquid, it is possible to clean and remove theliquid material adhered to the front end of the nozzle. When the liquidmaterial is adhered to the front end of the nozzle, the nozzle may beblocked thereby deteriorating the ejecting performance. In theinvention, it is possible to prevent the deterioration in the ejectingperformance by cleaning the front end of the nozzle.

In the coating device, the nozzle managing mechanism may include asuction portion which suctions the front end of each nozzle.

In this case, since the nozzle managing mechanism includes the suctionportion which suctions the front end of each nozzle, it is possible toremove the liquid material adhered to the front end of the nozzle or thecleaning liquid or the like used to clean the liquid material from thefront end of the nozzle. Accordingly, it is possible to maintain thefront end of the nozzle in a cleaner state.

In the coating device, the nozzle managing mechanism may include aliquid receiving portion which receives the liquid materialpreliminarily ejected from the nozzles.

In this case, since the nozzle managing mechanism includes the liquidreceiving portion which receives the liquid material preliminarilyejected from the nozzles, it is easy to perform the preliminary liquidmaterial ejecting operation. Accordingly, it is possible to prevent thedeterioration in the ejecting performance of the nozzle.

The coating device may further include a cup portion which is disposedso as to surround a side portion of the substrate.

In this case, since the coating device further includes the cup portionwhich is disposed so as to surround the side portion of the substrate,it is possible to block the liquid material flying from the substratedue to the centrifugal force caused by the rotation of the substrate.Accordingly, it is possible to maintain the inner circumstance of thedevice in a clean state.

In the coating device, the cup portion may include an accommodationportion which accommodates the liquid material.

In this case, since the cup portion includes the accommodation portionwhich accommodates the liquid material, it is possible to collect theflying liquid material in the accommodation portion. Accordingly, it ispossible to efficiently manage the flying liquid material.

In the coating device, a facing portion of the cup portion facing theside portion of the substrate may be provided so as to be separable fromother portions of the cup portion.

In this case, since a facing portion of the cup portion facing the sideportion of the substrate is provided so as to be separable from otherportions of the cup portion, it is easy to perform the maintenance ofthe cup portion. Accordingly, it is easy to clean the cup portion.

In the coating device, the cup portion may include an adjustingmechanism which adjusts the dimensions of an opening of the facingportion.

In this case, since the cup portion includes the adjusting mechanismwhich adjusts the dimension of the opening of the facing portion, it ispossible to flexibly handle the cases in which the coating processconditions such as the thickness of the substrate or the flying degreeof the liquid material are different.

In the coating device, the cup portion may include an inner cup and anouter cup.

In the coating device, the accommodation portion may include adischarging mechanism which discharges at least one of the liquidmaterial and a gas inside the accommodation portion.

In this case, since the accommodation portion includes the dischargingmechanism which discharges at least one of the liquid material and a gasinside the accommodation portion, it is possible to discharge the liquidmaterial in the accommodation portion by using the discharging mechanismand to form a stream of the gas in the accommodation portion.

In the coating device, the cup portion may be formed in a circularshape, and the discharging mechanism may be provided in the tangentialdirection of the outer periphery of the cup portion.

In this case, since the cup portion is formed in a circular shape, andthe discharging mechanism is provided in the tangential direction of theouter periphery of the cup portion, it is possible to discharge theliquid material along the rotation direction of the substrate.

In the coating device, the discharging mechanism may include agas-liquid separating mechanism which is provided in a discharge path.

Since the discharging mechanism includes the gas-liquid separatingmechanism which is provided in the discharge path, it is easy to handlethe liquid material.

The coating device may further include a cleaning liquid nozzle whichejects a cleaning liquid of the cup portion to the substrate.

In this case, since the coating device further includes the cleaningliquid nozzle which ejects the cleaning liquid of the cup portion to thesubstrate, it is possible to allow the cleaning liquid ejected onto thesubstrate to fly into the cup portion by the rotation of the substrate.Accordingly, it is possible to efficiently clean the cup portion.

In the coating device, the nozzle may be used as the cleaning liquidnozzle.

In this case, since the nozzle is used as the cleaning liquid nozzle, itis possible to improve the efficiency of maintenance.

The coating device may further include an adjusting portion whichadjusts a coating state of the outer periphery of the substrate.

In this case, since the coating device further includes the adjustingportion which adjusts the coating state of the outer periphery of thesubstrate, it is possible to improve the coating performance of theliquid material.

In the coating device, the adjusting portion may include a removingportion which removes the liquid material by dipping the outer peripheryof the substrate in a solution.

In this case, since the adjusting portion includes the removing portionwhich removes the liquid material by dipping the outer periphery of thesubstrate in a solution, it is possible to efficiently remove the liquidmaterial coated on the outer periphery.

In the coating device, the removing portion may include a solutionnozzle which ejects the solution to the peripheral edge of thesubstrate.

In this case, since the removing portion includes the solution nozzlewhich ejects the solution to the peripheral edge of the substrate, it ispossible to remove the periphery of the substrate using the solutionnozzle without moving the position of the substrate. Accordingly, it ispossible to improve the efficiency of the process of the substrate.

In the coating device, the solution nozzle may be capable of ejecting acleaning liquid of the cup portion.

In this case, since the solution nozzle is capable of ejecting thecleaning liquid of the cup portion, the solution nozzle is capable ofadjusting the coating state of the outer periphery of the substrate andcleaning the cup portion. Accordingly, since it is possible to performthe operations without providing a separate cup cleaning mechanism, itis possible to prevent the constitution of the device from beingcomplicated.

In the coating device, the removing portion may include a controlportion which ejects the solution from the solution nozzle at a positionwhere the solution does not contact with the substrate and moves thesolution nozzle to an ejecting position of the substrate in the statewhere the solution is ejected from the solution nozzle.

In this case, since the removing portion includes the control portionwhich ejects the solution from the solution nozzle at a position wherethe solution does not contact with the substrate and moves the solutionnozzle to an ejecting position of the substrate in the state where thesolution is ejected from the solution nozzle, it is possible to improvethe precision of adjusting the coating state of the outer periphery ofthe substrate.

In the coating device, the adjusting portion may include a secondsuction portion which suctions the outer periphery of the substrate.

In this case, since the adjusting portion includes the second suctionportion which suctions the outer periphery of the substrate, it ispossible to promptly remove the liquid material or the solution adheredto the outer periphery of the substrate.

Effect of the Invention

According to the first aspect of the invention, it is possible to reducethe process tact time by simplifying the constitution of the substrateprocessing system.

According to the second aspect of the invention, since it is possible toreduce the process tact time of the carrying device, it is possible toimprove the throughput.

According to the third aspect of the invention, it is possible toimprove the state of the liquid material coated on the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view showing a constitution of a substrate processingsystem according to the embodiment of the invention.

FIG. 2 is a front view showing the constitution of the substrateprocessing system according to the embodiment of the invention.

FIG. 3 is a side view showing the constitution of the substrateprocessing system according to the embodiment of the invention.

FIG. 4 is a view showing a constitution of a substrate carrying device.

FIGS. 5A and 5B are views showing a constitution of a suction member.

FIGS. 6A and 6B are views showing a constitution of a blocking member.

FIG. 7 is a view showing a constitution of a holding portion.

FIGS. 8A and 8B are views showing the constitution of the holdingportion.

FIG. 9 is a view showing a constitution of a substrate loading mechanismand a substrate unloading mechanism.

FIG. 10 is a view showing the constitution of the substrate loadingmechanism and the substrate unloading mechanism.

FIG. 11 is a view showing the constitution of the substrate loadingmechanism and the substrate unloading mechanism.

FIG. 12 is a view showing an operation of the substrate carrying device.

FIG. 13 is a view showing an operation of the substrate carrying device.

FIG. 14 is a view showing another constitution of the substrate carryingdevice according to the invention.

FIG. 15 is a view showing still another constitution of the substratecarrying device according to the invention.

FIG. 16 is a view showing a constitution of a coating device and asubstrate processing unit of the substrate carrying device according tothe invention.

FIG. 17 is a front view showing a constitution of the substrateprocessing unit.

FIG. 18 is a side view showing the constitution of the substrateprocessing unit.

FIG. 19 is a view showing a constitution of a front end of a nozzle.

FIG. 20 is a view showing a constitution of an inner cup.

FIG. 21 is a view showing a constitution of a nozzle managing mechanism.

FIG. 22 is a view showing a constitution of a peripheral edge removingmechanism.

FIG. 23 is a view showing another constitution of the peripheral edgeremoving mechanism.

FIGS. 24A and 24B are views showing another constitution of a coatingdevice according to the invention.

DETAILED DESCRIPTION OF THE INVENTION

The exemplary embodiments of the invention will be described withreference to the accompanying drawings.

FIG. 1 is a plan view showing a schematic constitution of a substrateprocessing system SYS according to the embodiment of the invention. FIG.2 is a front view showing the schematic constitution of the substrateprocessing system SYS. FIG. 3 is a side view showing the schematicconstitution of the substrate processing system SYS.

In the embodiment, upon describing the constitution of the substrateprocessing system SYS, for the purpose of the simple markings, an XYZcoordinate system is used to describe the directions in the drawings. Inthe XYZ coordinate system, the horizontal direction in the drawing ismarked as the X direction, and the direction perpendicular to the Xdirection in a plan view is marked as the Y direction. The directionperpendicular to a plane including the X and Y axes is marked as the Zdirection. In the X, Y, and Z directions, the arrow direction in thedrawing is the +direction, and the opposite direction of the arrowdirection is the −direction.

As shown in FIGS. 1 to 3, the substrate processing system SYS is asystem which is incorporated into, for example, a manufacture line of afactory or the like and forms a thin film on a predetermined area of asubstrate S. The substrate processing system SYS includes a stage unitSTU, a substrate loading unit LDU, a substrate processing unit SPU, asubstrate unloading unit ULU, a carrying unit CRU, and a control unitCNU.

The substrate processing system SYS, the stage unit STU is supported toa floor surface through, for example, a bridge member or the like. Thesubstrate processing unit SPU, the substrate loading unit LDU, thesubstrate unloading unit ULU, and the carrying unit CRU are disposed onthe upper surface of the stage unit STU. In the substrate processingunit SPU, the substrate loading unit LDU, the substrate unloading unitULU, and the carrying unit CRU, each inside thereof is covered by acover member. In the substrate processing system SYS, the substrateprocessing unit SPU, the substrate loading unit LDU, and the substrateunloading unit ULU are arranged in a linear shape along the X direction.The substrate processing unit SPU is disposed between the substrateloading unit LDU and the substrate unloading unit ULU. In a portion ofthe stage unit STU where the substrate processing unit SPU is disposed,a center thereof in a plan view is recessed in the −Z direction relativeto other portions.

As the substrate S as a processing object of the substrate processingsystem SYS according to the embodiment, for example, a semiconductorsubstrate such as silicon, a glass substrate forming a liquid crystalpanel, a substrate forming a hard disk, and the like may be exemplified.In the embodiment, as the substrate S, a substrate which forms a harddisk is an exemplary example. The substrate is formed of glass, and isformed as a disk-shaped base, of which a surface is coated with diamondand in which an opening (see FIGS. 12, 13, and the like) is formed atthe center thereof in a plan view.

A loading operation and an unloading operation of the substrate S in thesubstrate processing system SYS according to the embodiment areperformed by a cassette C capable of accommodating plural sheets of thesubstrates S. The cassette C is a container formed in a square shape,and is capable of accommodating plural sheets of substrates S in seriesso that the substrate surfaces face each other. Accordingly, thecassette C is configured to accommodate the substrates S in the statewhere the substrates S erect in the Z direction. The cassette C has anopening (see FIGS. 9 and 10) formed in a bottom portion thereof. Each ofthe substrates S is accommodated so as to be exposed from the bottomportion of the cassette C through the opening. The cassette C is formedin a rectangular shape in a plan view, and has, for example, anengagement portion Cx formed in the +Z-direction-side edge portion asshown in FIG. 2. In the embodiment, as the cassette C, two types ofcassettes, that is, a loading cassette C1 for loading the substrate Sand an unloading cassette C2 for unloading the substrate S are used. Theloading cassette C1 accommodates only the unprocessed substrate S, andthe unloading cassette C2 accommodates only the processed substrate S.The loading cassette C1 is used between the substrate processing unitSPU and the substrate loading unit LDU. The unloading cassette C2 isused between the substrate processing unit SPU and the substrateunloading unit ULU. Accordingly, the loading cassette C1 and theunloading cassette C2 are not used together. The loading cassette C1 andthe unloading cassette C2 are formed to have, for example, the sameshape and size.

Substrate Loading Unit

The substrate loading unit LDU is disposed on the −X direction side ofthe substrate processing system SYS. The substrate loading unit LDU is aunit which receives the loading cassette C1 accommodating theunprocessed substrate S, and collects the empty loading cassette C1. Thesubstrate loading unit LDU is elongated in the Y direction, and iscapable of accommodating plural loading cassettes C1 arranged in the Ydirection in a standby state.

The substrate loading unit LDU includes a cassette entrance 10 and acassette moving mechanism (second moving mechanism) 11. The cassetteentrance 10 is an opening which is provided in the −Y direction side ofthe cover member covering the substrate loading unit LDU. The cassetteentrance 10 is an inlet (supply opening) for the loading cassette C1accommodating the unprocessed substrates S, and an outlet (collectionopening) for the empty cassette C1.

The cassette moving mechanism 11 includes, for example, a drivingmechanism such as a belt conveyor mechanism. In the embodiment, as thedriving mechanism, conveyor belts (a supply belt 11 a and a collectionbelt 11 b) are provided. The conveyor belts extend in the Y directionfrom the +Y-direction-side end portion of the substrate loading unit LDUto the −Y-direction-side end portion thereof, where two conveyor beltsextend in the X direction.

Among two conveyor belts, the supply belt 11 a is a conveyor belt whichis disposed on the −X direction side. The +Z-direction-side surface ofthe supply belt 11 a is used as a conveyor surface. The supply belt 11 ais configured to rotate so that the conveyor surface moves in the +Ydirection. Plural loading cassettes C1, which enter the substrateloading unit LDU through the cassette entrance 10, are placed on theconveyor surface of the supply belt 11 a. The loading cassettes C1 aremoved to the carrying unit CRU by rotation of the supply belt 11 a.

Among two conveyor belts, the collection belt 11 b is a conveyor beltwhich is disposed on the +X direction side. The +Z-direction-sidesurface of the collection belt 11 b is used as a conveyor surface. Thecollection belt 11 b is configured to rotate so that the conveyorsurface moves in the −Y direction. Plural empty loading cassettes C1 areplaced on the conveyor surface of the collection belt 11 b. The loadingcassettes C1 are made to move to the cassette entrance 10 by rotation ofthe collection belt 11 b.

In the embodiment, for example, the loading cassettes C1 are capable ofstaying in a standby state at standby positions (container standbyportion) provided at five positions on the supply belt 11 a and thecollection belt 11 b. In the substrate loading unit LDU, it is possibleto move the standby position of the loading cassette C1 by rotating thesupply belt 11 a and the collection belt 11 b. It is possible to shortenthe carrying time of the loading cassette C1 by moving the standbyposition.

Substrate Processing Unit

The substrate processing unit SPU is disposed on the +X direction sideof the substrate loading unit LDU in the substrate processing system SYSso as to be substantially located at the center in the X direction. Thesubstrate processing unit SPU is a unit which performs various processessuch as a process of coating a liquid material such as resist on thesubstrate S so as to form a thin film thereon and a process of removingthe thin film formed on the peripheral portion of the substrate S. Thesubstrate processing unit SPU includes a coating device (a substrateprocessing area) CT, a peripheral edge removing device EBR, buffermechanisms (a substrate loading area and a substrate unloading area) BF,and substrate carrying devices (carrying device) SC.

The coating device CT is substantially disposed at the center of thesubstrate processing unit SPU in a plan view, and is fixed to the uppersurface of the recessed portion of the stage unit STU. The coatingdevice CT is a device which coats a liquid material on the substrate Sso as to form a thin film thereon. In the embodiment, the coating deviceCT forms a thin film, used to perform an imprinting process, on thesubstrate S. The coating device CT includes a nozzle (not shown) whichejects the liquid material as a material forming the thin film onto thesubstrate S. The access to the coating device CT is possible from both−X direction side and +X direction side of the coating device CT.Accordingly, for example, the loading operation and the unloadingoperation of the substrate S are possible from both −X direction sideand the +X direction side. The coating device CT is configured toperform a coating process at a coating position (a position depicted bythe dashed line in the drawing) substantially positioned in the centerof the STU unit in the X direction.

The peripheral edge removing device EBR is provided at a position on the+X direction side of the coating device CT along the −Y-direction-sideedge of the substrate processing unit SPU. The peripheral edge removingdevice EBR is a device which removes the thin film formed on theperipheral edge of the substrate S. It is desirable that a removingprocess using the peripheral edge removing device EBR is performed in astate where the thin film formed on the substrate S is not dried. Forthis reason, it is desirable that the peripheral edge removing deviceEBR is disposed at a position capable of carrying the substrate S fromthe coating device CT. The peripheral edge removing device EBR includes,for example, a dip portion (not shown) which dissolves and removes thethin film formed on the peripheral edge of the substrate S by rotatingthe substrate S in a state where the peripheral edge of the substrate Sis dipped in a solution.

The buffer mechanisms BF are respectively provided at two positionsalong the +Y-direction-side edge of the substrate processing unit SPUwith the coating device CT interposed therebetween in the X direction.Among the buffer mechanisms BF at two positions, the buffer mechanismdisposed on the −X direction side of the coating device CT is a loadingbuffer mechanism (substrate loading area) BF1, and the buffer mechanismdisposed on the +X direction side of the coating device CT is anunloading buffer mechanism (substrate unloading area) BF2.

The loading buffer mechanism BF1 is a portion where the loading cassetteC1 supplied to the substrate processing unit SPU stays in a standbystate. The loading buffer mechanism BF1 is provided with a cassettemoving mechanism (third moving mechanism) 20. The cassette movingmechanism 20 includes, for example, a driving mechanism such as aconveyor mechanism. In the embodiment, as the driving mechanism, twoconveyor belts 20 a and 20 b are provided.

The conveyor belt 20 a is provided in an area in the X direction of theloading buffer mechanism BF1. The +Z-direction-side surface of theconveyor belt 20 a is used as a conveyor surface, and the suppliedloading cassette C1 is placed on the conveyor surface. The conveyor belt20 a is adapted to rotate so that the conveyor surface moves in Xdirection. It is possible to move the loading cassette C1 in the Xdirection of the loading buffer mechanism BF1 by rotating of theconveyor belt 20 a. The conveyor belt 20 b is provided at the center inthe X direction of the loading buffer mechanism BF1. The+Z-direction-side surface of the conveyor belt 20 b is used as aconveyor surface, and the loading cassette C1 is placed on the conveyorsurface. The conveyor belt 20 b is adapted to rotate so that theconveyor surface moves in the Y direction. By the rotation of theconveyor belt 20 b, the loading cassette C1 moves in the Y direction.Likewise, the cassette moving mechanism 20 moves the standby position ofthe loading cassette C1.

In the loading buffer mechanism BF1, plural, for example, three loadingcassettes C1 are arranged in the X direction of the formation area ofthe conveyor belt 20 a so as to stay in a standby state (secondcontainer standby portion). The standby position P1 on the −X directionside of the drawing is, for example, a standby position for the loadingcassette C1 supplied to the substrate processing unit SPU. The standbyposition P2 at the center in the X direction of the drawing is a standbyposition for the loading cassette C1 moving from the standby positionP1. The standby position P3 on the +X direction side of the drawing is astandby position for the loading cassette C1 moving from the standbyposition P2.

The +Y-direction-side end portion of the conveyor belt 20 b is disposedinside the standby position P2. For this reason, the loading cassette C1disposed at the standby position P2 moves in the −Y direction siderelative to the standby position P2 by the conveyor belt 20 b, and staysat the standby position P4 in a standby state. A loading position LP forthe substrate S is provided on the +Z direction side of the standbyposition P4. The substrate S is carried to the coating device CT throughthe loading position LP.

The unloading buffer mechanism BF2 is a portion of SPU where theunloading cassette C2 supplied to the substrate processing unit SPUstays in a standby state. The unloading buffer mechanism BF2 is providedwith a cassette moving mechanism (third moving mechanism) 22. Thecassette moving mechanism 22 includes, for example, a driving mechanismsuch as a belt conveyor. In the embodiment, as in the loading buffermechanism BF1, two conveyor belts 22 a and 22 b are provided as thedriving mechanism.

The conveyor belt 22 a is provided in an area in the X direction of theunloading buffer mechanism BF2. The +Z-direction-side surface of theconveyor belt 22 a is used as a conveyor surface, and the suppliedunloading cassette C2 is placed on the conveyor surface. The conveyorbelt 22 a is adapted to rotate so that the conveyor surface moves in theX direction. It is possible to move the unloading cassette C2 in the Xdirection of the unloading buffer mechanism BF2 by rotating of theconveyor belt 22 a. The conveyor belt 22 b is provided at the center inthe X direction of the unloading buffer mechanism BF2. As in theconveyor belt 20 b, the +Z-direction-side surface of the conveyor belt22 b is used as a conveyor surface, and the unloading cassette C2 isplaced on the conveyor surface. The conveyor belt 22 b is adapted torotate so that the conveyor surface moves in the Y direction. By therotation of the conveyor belt 22 b, the unloading cassette C2 moves inthe Y direction. Thus, the cassette moving mechanism 22 moves thestandby position of the unloading cassette C2.

In the unloading buffer mechanism BF2, multiple, for example, three,loading cassettes C2 are arranged in the X direction on the conveyorbelt 22 a so as to stay in a standby state (second container standbyportion). The standby position P5 on the −X direction side of thedrawing is, for example, a standby position for the unloading cassetteC2 supplied to the substrate processing unit SPU. The standby positionP6 at the center in the X direction of the drawing is a standby positionfor the unloading cassette C2 moving from the standby position P5. Thestandby position P7 on the +X direction side of the drawing is a standbyposition for the unloading cassette C2 moving from the standby positionP6.

The +Y-direction-side end portion of the conveyor belt 22 b is disposedinside the standby position P6. For this reason, the unloading cassetteC2 disposed at the standby position P6 moves in the −Y direction siderelative to the standby position P6 by the conveyor belt 22 b, and staysat the standby position P8 in a standby state. An unloading position UPfor the substrate S is provided on the +Z direction side of the standbyposition P8. The substrate S is carried from the coating device CT tothe unloading cassette C2 through the unloading position UP.

The substrate carrying devices SC are provided at two positions with thecoating device CT interposed therebetween in the X direction so as to belocated at the center in the Y direction of the substrate processingunit SPU. Among the substrate carrying devices SC at two positions, adevice disposed on the −X direction side of the coating device CT is aloading carrying device SC1, and a device disposed on the +X directionside of the coating device CT is an unloading carrying device SC2. Theloading carrying device SC1, the unloading carrying device SC2, and thecoating device CT are arranged in a linear shape in the X direction.

The loading carrying device SC1 accesses the coating device CT and theloading position LP of the loading buffer mechanism BF1 so as to carrythe substrate S therebetween. FIG. 4 is a schematic view showing aconstitution of the loading carrying device. As shown in FIGS. 1 to 4,the loading carrying device SC1 includes a base portion 30, an armportion 31, and a holding portion (suction portion) 32.

The base portion 30 is provided on the upper surface of the recessedportion of the stage unit STU. The base 30 includes a fixed table 30 a,a rotary table 30 b, a rotary mechanism 30 c, and support members 30 d.

The fixed table 30 a is fixed to the upper surface of the recessedportion of the stage unit STU. The base portion 30 is fixed onto thestage unit STU through the fixed table 30 a so that the positionaldeviation does not occur. The rotary table 30 b is disposed on the fixedtable 30 a through the rotary mechanism 30 c. The rotary table 30 b isadapted to be rotatable about the Z axis serving as the rotary axisrelative to the fixed table 30 a. The rotary mechanism 30 c is a drivingmechanism which is provided between the fixed table 30 a and the rotarytable 30 b, and applies the rotation force to the rotary table 30 b.Each of the support members 30 d is a column member of which the−Z-direction-side end portion is fixed onto the rotary table 30 b. Thesupport members 30 d are provided at a plurality of positions, forexample, two positions of the rotary table 30 b. The +Z-direction-sideend portion of the support member 30 d is inserted into the arm portion31.

The arm portion 31 is supported by the support members 30 d of the baseportion 30. The arm portion 31 moves the holding portion 32 to differentpositions inside the substrate processing unit SPU. The arm portion 31includes a casing 31 a formed in a pentagonal column. A front endsurface 31 b of the casing 31 a is provided with an opening 31 c. Arotary mechanism 33, a suction mechanism 34, and a moving mechanism 35are provided inside the casing 31 a.

The rotary mechanism 33 is disposed on the +Z direction side inside thecasing 31 a. The rotary mechanism 33 includes a motor device 33 a and arotary shaft member 33 b. The motor device 33 a and the rotary shaftmember 33 b are adapted to be movable together in the horizontaldirection in the drawing. The motor device 33 a is a driving devicewhich applies the rotation force to the rotary shaft member 33 b. Therotary shaft member 33 b is a bar-shaped member which has a circularsection and is disposed in parallel to the XY plane.

The rotary shaft member 33 b is adapted to be rotatable about the centerof the circle serving as the rotary axis by the driving force of themotor device 33 a. The rotary shaft member 33 b is disposed so that oneend thereof protrudes from the opening 31 c to the outside of the casing31 a (protrusion 33 c). The end surface of the rotary shaft member 33 bon the side of the protrusion 33 c is provided with a concave portion 33d used for mounting the holding portion 32 thereto. The concave portion33 d is formed in a circular shape in a sectional view. The protrusion33 c includes a fixing mechanism which fixes the holding portion 32 inthe state where the holding portion 32 is mounted to the concave portion33 d. Since the holding portion 32 is fixed by the fixing mechanism, therotary shaft member 33 b and the holding portion 32 are adapted to bemovable together.

The rotary shaft member 33 b includes a perforation hole 33 e. Theperforation hole 33 e is formed so as to perforate a range from a bottomsurface 33 f of the concave portion 33 d of the rotary shaft member 33 bto an end surface 33 g on the other side of the rotary shaft member 33b. The bottom surface 33 f of the concave portion 33 d of the rotaryshaft member 33 b communicates with the end surface 33 g through theperforation hole 33 e.

The suction mechanism 34 is provided in the end surface 33 g of therotary shaft member 33 b. The suctioning means 34 includes a suctioningdevice such as a suction pump 34 a. The suction pump 34 a is connectedto the perforation hole 33 e of the end surface 33 g of the rotary shaftmember 33 b. The suction pump 34 a suctions the perforation hole 33 efrom the end surface 33 g of the rotary shaft member 33 b, therebysuctioning the holding portion 32 disposed on the bottom surface 33 f ofthe concave portion 33 d communicating with the perforation hole 33 e.

The moving mechanism 35 is disposed on the −Z direction side inside thecasing 31 a. The moving mechanism 35 includes a motor device 35 a, arotary shaft member 35 b, and a movable member 35 c. The motor device 35a is a driving device which applies the rotation force to the rotaryshaft member 35 b. The rotary shaft member 35 b is a bar-shaped memberwhich has a circular section and of which one end is inserted in themotor device 35 a. The rotary shaft member 35 b is adapted to berotatable about the center of the circle serving as the rotary axis bythe motor device 35 a.

The movable member 35 c includes a screw-connection portion 35 d and aconnection portion 35 e. The screw-connection portion 35 d is integrallyformed with the rotary shaft member 35 b, and has a thread ridge (notshown) formed on the surface thereof. The connection portion 35 e isfixed to, for example, the motor device 33 a of the rotary mechanism 33.A thread ridge is formed on the lower surface of the connection member35 e, and adapted to mesh with the thread ridge formed in thescrew-connection portion 35 d.

When the motor device 35 a rotates the rotary shaft member 35 b, therotary shaft member 35 b and the screw-connection portion 35 d areadapted to rotate together. By rotation of the screw-connection portion35 d, the connection member 35 e meshing with the thread ridge of thescrew-connection portion 35 d is adapted to move in the left or rightdirection in the drawing, and the connection member 35 e and the fixingmechanism 33 fixed to the connection member 35 e are adapted to movetogether in the left or right direction in the drawing. By means of themovement, the holding portion 32 provided in the right end of the rotarymechanism 33 in the drawing is adapted to move in the horizontaldirection in the drawing.

The holding portion 32 is separably fixed to the concave portion 33 d ofthe rotary shaft member 33 b. The holding portion 32 holds, for example,the substrate S by using the holding force such as the absorption force.The holding portion 32 includes a suction member 36 and a blockingmember 37. The suction member 36 and the blocking member 37 areseparably provided.

FIGS. 5A and 5B are views showing a constitution of the suction member36. FIG. 5A is a front view showing the suction member 36, and FIG. 5Bis a side view showing the suction member 36.

The suction member 36 includes an absorbing portion 36 a and a mountingportion 36 b. The absorbing portion 36 a is provided on thefront-surface-side of the suction member 36 in the drawing so as to havea disk shape. The absorbing portion 36 a is a portion which absorbs thesubstrate S. The front-surface-side end surface of the absorbing portion36 a is formed as an absorbing surface 36 e which absorbs the substrateS. The absorbing surface 36 e is provided with a groove portion 36 c.The groove portion 36 c is formed in, for example, a cross shape in afront view. When viewed from the front surface of the absorbing portion36 a, the groove portion 36 c is formed to be deeper toward the centerthereof relative to the absorbing surface 36 e.

The mounting portion 36 b is formed in a bar shape so as to be locatedat the center of the rear surface of the suction member 36. The mountingportion 36 b is a portion inserted into the concave portion 33 d. Therear-surface-side end surface of the mounting portion 36 b is formed ina contact surface 36 f which comes into contact with the bottom portionof the concave portion 33 d during the mounting operation. The mountingportion 36 b is formed to have a diameter of not more than that of theconcave portion 33 d.

The suction member 36 is provided with a perforation hole 36 d. Theperforation hole 36 d is formed at the center of the absorbing portion36 a and the mounting portion 36 b, and is formed to perforate theabsorbing portion 36 a and the mounting portion 36 b from the frontsurface thereof to the rear surface thereof. The perforation hole 36 dis connected to the groove portion 36 c on the side of the absorbingportion 36 a. The absorbing surface 36 e including the groove portion 36c communicates with the contact surface 36 f through the perforationhole 36 d.

In the case where the mounting portion 36 b is mounted to the concaveportion 33 d, the perforation hole 36 d communicates with theperforation hole 33 e of the rotary shaft member 33 b. For this reason,the absorbing surface 36 e of the suction member 36 is connected to thesuction pump 34 a of the suctioning mechanism 34 through the perforationholes 33 e and 36 d.

FIGS. 6A and 6B are views showing a constitution of the blocking member37. FIG. 6A is a front view showing the blocking member 37, and FIG. 6Bis a side view showing the blocking member 37.

The blocking member 37 includes a blocking portion 37 a which is formedin a disk shape and an engagement portion 37 b which is formed in acylindrical shape so as to be located at the center of the rear surfaceof the blocking portion 37 a.

The blocking portion 37 a is formed to have a diameter smaller than thatof the opening of the substrate S so as to be inserted into the openingof the substrate S. The thickness (a dimension in the horizontaldirection in FIG. 6B) of the blocking portion 37 a is formed to bethinner than that of the substrate S. In the case where the blockingportion 37 a is inserted into the opening of the substrate S, theblocking portion 37 a does not protrude from the substrate S.

The engagement portion 37 b is formed so as to be inserted into theperforating hole 36 d of the absorbing portion 36 a. The engagementportion 37 b is formed to have a diameter of not more than that of theperforation hole 36 d. The engagement portion 37 b is formed to have athickness dimension (a dimension in the horizontal direction in FIG. 6B)smaller than the distance between the deepest position of the grooveportion 36 c formed at the absorbing portion 36 a and the absorbingsurface of the absorbing portion 36 a. The engagement portion 37 b isable to be inserted into the perforation hole 36 d.

FIG. 7 is a front view showing the state where the blocking member 37 ismounted to the suction member 36. FIG. 8A is a sectional view takenalong the line A-A in FIG. 7. FIG. 8B is a sectional view taken alongthe line B-B in FIG. 7.

When the engagement portion 37 b is inserted into the perforation hole36 d of the suction member 36, the blocking member 37 is mounted to thesuction member 36. In the mounting state, the rear surface of theblocking portion 37 a is supported to the absorbing surface of theabsorbing portion 36 a, and a part of the groove portion 36 c is blockedby the blocking portion 37 a in a front view thereof. Since thethickness dimension of the engagement portion 37 b is smaller than thedistance between the deepest position of the groove portion 36 c and theabsorbing surface, as shown in FIG. 8A, the perforation hole 36 d is notcompletely blocked by the engagement portion 37 b, and a gap is formedbetween the groove portion 36 c and the perforation hole 36 d.

The loading carrying device SC1 with the above-described constitutionallows the holding portion 32 to access both the coating device CT andthe loading position LP in such a manner that the arm portion 31 rotatesabout the Z axis serving as the rotary axis or moves in the XY plane.The rotary shaft members disposed in the arm portion 31 and the like mayhave a constitution in which plural shaft members are connected throughcouplings.

Returning to FIGS. 1 to 3, the unloading carrying device SC2 accessesthe coating device CT, the unloading position UP of the unloading buffermechanism BF2, and the peripheral edge removing device EBR so as tocarry the substrate S therebetween. The unloading carrying device SC2includes a base portion 40 (a fixed table 40 a and a rotary table 40 b),an arm portion 41, and a holding portion (suction portion) 42. Since theconstitution of the unloading carrying device SC2 is the same as that ofthe loading carrying device SC1, the description of the respectiveconstituents will be omitted. In FIGS. 4 to 8, the constituents of theunloading carrying device SC2 corresponding to the constituents of theloading carrying device SC1 are indicated by the parenthesized signs.Hereinafter, upon mentioning the constituents of the unloading carryingdevice SC2, the names of the corresponding constituents of the loadingcarrying device SC1 are used, and the parenthesized signs in FIGS. 4 to8 are respectively added to the names.

The substrate processing unit SPU includes a substrate loading mechanism(pickup mechanism) 21 and a substrate unloading mechanism 27 in additionto the above-described constitution. The substrate loading mechanism 21is disposed in the vicinity of the standby position P4. FIGS. 9 to 11are views schematically showing a constitution of the substrate loadingmechanism 21.

As shown in the drawings, the substrate loading mechanism 21 includes asubstrate upper portion holding mechanism 23 and a substrate lowerportion holding mechanism 24. The substrate upper portion holdingmechanism 23 is disposed on the +X direction side of the standbyposition P4. The substrate upper portion holding mechanism 23 moves inthe Z direction while holding the +Z-direction-side portion of thesubstrate S. The substrate upper portion holding mechanism 23 includesan elevating member 23 a, a clamping member 23 b, and an elevatingmechanism 23 c.

The elevating member 23 a is a column member which is formed in anL-shape in a side view and is movable in the Z direction. The elevatingmember 23 a includes a column portion which extends in the Z directionand a protrusion which protrudes from the front end of the columnportion in the X direction. Among them, the column portion is providedup to the +Z direction side of the +Z-direction-side end surface of theloading cassette C1. The protrusion of the elevating member 23 a isdisposed at a position overlapping with the loading position LP in aplan view. The −Z-direction-side portion of the protrusion is providedwith a concave portion matching with the shape of the substrate S.

The clamping member 23 b is mounted to the concave portion of theelevating member 23 a. Accordingly, the clamping member 23 b is providedat a position overlapping with the loading position LP in a plan view.The elevating mechanism 23 c is a driving portion which is mounted tothe elevating member 23 a, and is disposed on the −Z direction side ofthe loading cassette C1. As the elevating mechanism 23 c, for example, adriving mechanism such as an air cylinder may be used.

The substrate lower portion holding mechanism 24 is provided at aposition overlapping with the center of the loading position LP in aplan view. The substrate lower portion holding mechanism 24 moves in theZ direction while holding the −Z-direction-side portion of the substrateS. The substrate lower portion holding mechanism 24 includes anelevating member 24 a, a clamping member 24 b, and an elevatingmechanism 24 c. The elevating member 24 a is a column member which isformed in a bar shape and is movable in the Z direction. The clampingmember 24 b is mounted to the +Z-direction-side front end of theelevating member 24 a. The clamping member 24 b is disposed at aposition overlapping with the center of the loading position LP in aplan view. The elevating mechanism 24 c is a driving portion which ismounted to the elevating member 24 a, and is disposed on the −Zdirection side of the loading cassette C1. As the elevating mechanism 24c, for example, a driving mechanism such as an air cylinder may be used.

It is possible to separately operate the elevating mechanism 23 c of thesubstrate upper portion holding mechanism 23 and the elevating mechanism24 c of the substrate lower portion holding mechanism 24, and to operatethem in an interlocking manner.

The substrate unloading mechanism 27 is disposed in the vicinity of thestandby position P8. The substrate unloading mechanism 27 has the sameconstitution as that of the substrate loading mechanism 21. In FIGS. 9to 11, the constituents (including the unloading position UP) of thesubstrate unloading mechanism 27 corresponding to the constituents(including the loading position LP) of the substrate loading mechanism21 are indicated by the parenthesized signs.

The substrate unloading mechanism 27 includes a substrate upper portionholding mechanism 25 and a substrate lower portion holding mechanism 26.The substrate upper portion holding mechanism 25 includes an elevatingmember 25 a, a clamping member 25 b, and an elevating mechanism 25 c.The substrate lower portion holding mechanism 26 includes an elevatingmember 26 a, a clamping member 26 b, and an elevating mechanism 26 c.Since the positional relationship, the function, and the like of therespective constituents of the substrate unloading mechanism 27 are thesame as those of the corresponding constituents of the substrate loadingmechanism 21, the description thereof will be omitted.

Substrate Unloading Unit

Returning to FIGS. 1 to 3, the substrate unloading unit ULU is disposedon the +X direction side of the substrate processing unit SPU in thesubstrate processing system SYS. The substrate unloading unit ULU is aunit which collects the unloading cassette C2 accommodating theprocessed substrate S and receives the empty unloading cassette C2. Thesubstrate unloading unit ULU is elongated in the Y direction, and iscapable of accommodating plural unloading cassettes C2 arranged in the Ydirection.

The substrate unloading unit ULU includes a cassette entrance 60 and acassette moving mechanism (second moving mechanism) 61. The cassetteentrance 60 is an opening which is provided on the −Y direction side ofthe cover member covering the substrate unloading unit ULU. The cassetteentrance 60 is an inlet (supply opening) for the empty unloadingcassette C2, and an outlet (collection opening) for the unloadingcassette C2 accommodating the processed substrate S.

The cassette moving mechanism 61 includes, for example, a drivingmechanism such as a belt conveyor mechanism. In the embodiment, as thedriving mechanism, conveyor belts are provided. The conveyor beltsextend in the Y direction from the +Y-direction-side end portion of thesubstrate unloading unit ULU to the −Y-direction-side end portionthereof, where two conveyor belts are arranged in the X direction.

Among two conveyor belts, the supply belt 61 a is a conveyor belt whichis disposed on the −X direction side. The +Z-direction-side surface ofthe supply belt 61 a is used as a conveyor surface. The supply belt 61 ais adapted to rotate so that the conveyor surface moves in the +Ydirection. Plural unloading cassettes C2, which enter the substrateunloading unit ULU through the cassette entrance 60, are placed on theconveyor surface of the supply belt 61 a. The unloading cassettes C2 aremoved to the carrying unit CRU by the rotation of the supply belt 61 a.

Among two conveyor belts, the collection belt 61 b is a conveyor beltwhich is disposed on the +X direction side. The +Z-direction-sidesurface of the collection belt 61 b is used as a conveyor surface. Thecollection belt 61 b is adapted to rotate so that the conveyor surfacemoves in the −Y direction. Plural unloading cassettes C2 accommodatingthe processed substrates S are placed on the conveyor surface of thecollection belt 61 b. The unloading cassettes C2 are allowed to move tothe cassette entrance 60 by the rotation of the collection belt 61 b.

In the embodiment, for example, the unloading cassettes C2 are capableof staying in a standby state at standby positions (container standbyportion) provided at five positions on the supply belt 61 a and thecollection belt 61 b. In the substrate unloading unit ULU, it ispossible to move the standby position of the unloading cassette C2 byrotating the supply belt 61 a and the collection belt 61 b. It ispossible to shorten the carrying time of the unloading cassette C2 bymoving the standby position.

Carrying Unit

The carrying unit CRU is disposed in an area along the +Y-direction-sideedge inside the substrate processing system SYS, and is disposed so asto be adjacent to the substrate processing unit SPU, the substrateloading unit LDU, and the substrate unloading unit ULU. The carryingunit CRU carries the loading cassette C1 between the substrateprocessing unit SPU and the substrate loading unit LDU, and carries theunloading cassette C2 between the substrate processing unit SPU and thesubstrate unloading unit ULU. The carrying unit CRU includes a railmechanism RL and a cassette carrying device CC.

The rail mechanism RL is fixed onto the stage unit STU, and extends in alinear shape in the X direction from the −X-direction-side end portionof the carrying unit CRU to the +X-direction-side end portion thereof.The rail mechanism RL is a guiding mechanism which guides the movingposition of the cassette carrying device CC. The rail mechanism RLincludes two rail members 70 which are parallel in the Y direction.

The cassette carrying device CC is provided on two rail members 70 so asto be suspended on the two rail members 70 in a plan view. The cassettecarrying device CC is a carrying device which accesses the buffermechanism BF of the substrate processing unit SPU, the substrate loadingunit LDU, and the substrate unloading unit ULU, and holds and carriesthe loading cassette C1 and the unloading cassette C2. The cassettecarrying device CC includes a movable member 71, a cassette supportplate 72, a support plate rotating mechanism 73, a cassette holdingmember 74, a holding member elevating mechanism 75, and a holding membersliding mechanism 76.

The movable member 71 is formed in an H-shape in a plan view, andincludes concave portions 71 a which are respectively fitted to two railmembers 70. The movable member 71 includes therein, for example, adriving mechanism (a motor mechanism or the like) which is not shown inthe drawing. The movable member 71 is adapted to be movable in a lineararea along the rail members 70 by the driving force of the drivingmechanism.

The cassette support plate 72 is a plate-shaped member which is fixed tothe movable member 71 and is formed in a rectangular shape in a planview. The cassette support plate 72 is formed to have a dimension largerthan that of the bottom portion of each of the loading cassette C1 andthe unloading cassette C2, and is capable of stably placing the loadingcassette C1 and the unloading cassette C2 thereon. Since the cassettesupport plate 72 is fixed to the movable member 71, the cassette supportplate 72 moves together with the movable member 71.

The support plate rotating mechanism 73 is a rotary mechanism whichrotates the cassette support plate 72 in the XY plane where the Z axisserves as the rotary axis. The support plate rotating mechanism 73 iscapable of changing the longitudinal direction of each of the loadingcassette C1 and the unloading cassette C2 placed on the cassettecarrying device CC by rotating the cassette support plate 72.

The cassette holding member 74 is a holding member which is disposed onthe +Y direction side of the cassette support plate 72 in a plan viewand is formed in a U-shape in a plan view. The cassette holding member74 is provided so that the X-direction position thereof overlaps withthe cassette support plate 72. The cassette holding member 74 issupported to the movable member 71 through a support member (not shown),and is movable together with the movable member 71. Both end portions,formed in a U-shape, of the cassette holding member 74 are formed as aholding portion 74 a which engages with the engagement portion Cxprovided in each of the loading cassette C1 and the unloading cassetteC2. A gap of the holding portion 74 a (both end portions formed in aU-shape) in the X direction is adjustable in accordance with a gap ofthe engagement portion Cx provided in each of the loading cassette C1and the unloading cassette C2. The cassette holding member 74 is capableof further reliably holding the loading cassette C1 and the unloadingcassette C2 in the Z direction in such a manner that the holding portion74 a engages with the engagement portion Cx.

The holding member elevating mechanism 75 is a moving mechanism which isprovided in the cassette holding member 74 and moves the cassetteholding member 74 in the Z direction. As the holding member elevatingmechanism 75, for example, a driving mechanism such as an air cylindermay be used. When the cassette holding member 74 moves in the +Zdirection by using the holding member elevating mechanism 75, it ispossible to lift the loading cassette C1 and the unloading cassette C2held by the cassette holding member 74. On the contrary, when thecassette holding member 74 moves in the −Z direction by using theholding member elevating mechanism 75, it is possible to place thelifted cassette on a desired position.

The holding member sliding mechanism 76 is a moving mechanism which isprovided in the cassette holding member 74, and moves the cassetteholding member 74 in the Y direction. The holding member slidingmechanism 76 includes a guide bar 76 a which extends in the Y directionand a movable member 76 b which moves along the guide bar 76 a. Themovable member 76 b is fixed to the cassette holding member 74. When themovable member 76 b moves in the Y direction along the guide bar 76 a,the cassette holding member 74 moves together with the movable member 76b in the Y direction.

Control Unit

The control unit CNU is provided in the stage unit STU of the substrateprocessing system SYS. The control unit CNU includes, for example, acontrol device which controls all operations in the respective units anda material supply source which supplies a material required for eachunit, where all operations include a substrate processing operation inthe substrate processing unit SPU, a cassette moving operation in thesubstrate loading unit LDU or the substrate unloading unit ULU, acarrying operation in the carrying unit CRU, and the like. The materialsupply source may be exemplified by, for example, a liquid materialsupply source, a cleaning liquid supply source, or the like.

Next, an operation of the substrate processing system SYS having theabove-described constitution will be described. The operations performedby the respective units of the substrate processing system SYS arecontrolled by the control unit CNU. In the below description, the unitperforming the operation is mainly described, but actually, theoperation is performed on the basis of the control of the control unitCNU.

Cassette Supply Operation

First, the cassette supply operation in which the loading cassette C1accommodating the unprocessed substrate S is disposed in the substrateloading unit LDU, and the empty unloading cassette C2 is disposed in thesubstrate unloading unit ULU will be described.

For example, by a supply device (not shown) or the like, the loadingcassette C1 accommodating the unprocessed substrate S is supplied to thesubstrate loading unit LDU through the cassette entrance 10. Thesubstrate loading unit LDU checks that the loading cassette C1 is placedon the −Y-direction-side end portion of the supply belt 11 a, and thenrotates the supply belt 11 a. The loading cassette C1 moves in the +Ydirection by the rotation of the supply belt 11 a. The substrate loadingunit LDU temporarily stops the rotation of the belt when the supply belt11 a moves by an amount corresponding to a space of the loading cassetteC1, and allows the loading cassette C1 to be in a standby state untilthe next loading cassette C1 is supplied. When the next loading cassetteC1 is supplied, in the same manner as described above, the substrateloading unit LDU temporarily stops the rotation of the belt when thesupply belt 11 a moves by an amount corresponding to a space of theloading cassette C1, and allows the loading cassette C1 to be in astandby state again. When the loading cassettes C1 are sequentiallysupplied by rotating the supply belt 11 a, plural loading cassettes C1accommodating the unprocessed substrates S are arranged inside thesubstrate loading unit LDU.

On the other hand, for example, by a supply device (not shown) or thelike, the empty unloading cassette C2 is supplied to the substrateunloading unit ULU through the cassette entrance 60. The substrateunloading unit ULU checks that the unloading cassette C2 is placed onthe −Y-direction-side end portion of the supply belt 61 a, and thenrotates the supply belt 61 a. The unloading cassette C2 moves in the +Ydirection by the rotation of the supply belt 61 a. The substrateunloading unit ULU temporarily stops the rotation of the belt when thesupply belt 61 a moves by an amount corresponding to a space of theunloading cassette C2, and allows the unloading cassette C2 to be in astandby state until the next cassette C2 is supplied. When the nextunloading cassette C2 is supplied, in the same manner as describedabove, the substrate unloading unit ULU temporarily stops the rotationof the belt when the supply belt 61 a moves by an amount correspondingto a space of the unloading cassette C2, and allows the unloadingcassette C2 to be in a standby state again. When the unloading cassettesC2 are sequentially supplied by rotating the supply belt 61 a, pluralempty unloading cassettes C2 are arranged inside the substrate unloadingunit ULU.

Cassette Carrying Operation

Next, the cassette carrying operation in which the loading cassette C1supplied to the substrate loading unit LDU and the unloading cassette C2supplied to the substrate unloading unit ULU are respectively suppliedto the substrate processing unit SPU will be described. The cassettecarrying operation is performed by using the cassette carrying device CCprovided in the carrying unit CRU.

The operation of carrying the loading cassette C1 will be described. Thecarrying unit CRU moves the cassette carrying device CC in the Xdirection up to a position adjacent to the substrate loading unit LDU,and performs a positioning operation so as to overlap with the positionof the loading cassette C1 in the X direction. After the positioningoperation, the carrying unit CRU moves the cassette holding member 74 ina sliding manner in the −Y direction, and disposes the holding portion74 a at the −Z-direction-side portion of the engagement portion Cx ofthe loading cassette C1 staying in a standby state at the farthest+Y-direction-side position inside the substrate loading unit LDU. Thecarrying unit CRU adjusts the X-direction gap of the holding portion 74a and the Z-direction position thereof in advance so that the holdingportion 74 a is smoothly disposed in a sliding manner at the−Z-direction-side portion of the engagement portion Cx.

After the holding portion 74 a engages with the engagement portion Cx,the carrying unit CRU moves the cassette member 74 in the +Z directionso as to lift the loading cassette C1. The carrying unit CRU moves thecassette holding member 74 lifting the loading cassette C1 in the +Ydirection in a sliding manner so that the loading cassette C1 moves to aposition overlapping with the cassette support plate 72 in a plan view.The carrying unit CRU moves the cassette holding member 74 located atthat position in the −Z direction so as to place the loading cassette C1on the cassette support plate 72. The carrying unit CRU adjusts adirection of the cassette support plate 72 in advance so that thelongitudinal direction of the cassette C1 aligns with the longitudinaldirection of the cassette support plate 72 upon placing the loadingcassette C1 on the cassette support plate 72. According to thesesoperations, the loading cassette C1 located on the farthest +Y directionside inside the substrate loading unit LDU is transferred to thecassette carrying device CC. After the transfer operation, the substrateloading unit LDU moves the supply belt 11 a so that the loading cassetteC1 disposed on the farthest +Y direction side among the rest of theloading cassettes C1 inside the substrate loading unit LDU is disposedat the +Y-direction-side end portion of the substrate loading unit LDU.According to this operation, since the rest of the loading cassettes C1move together in the +Y direction, the space on the −Y direction side onthe supply belt 11 a is empty. Accordingly, a new loading cassette C1 issupplied to the empty space by a supply mechanism (not shown).

After the transfer operation of the loading cassette C1, the carryingunit CRU moves the cassette carrying device CC in the +X direction, androtates the cassette support plate 72 so that the longitudinal directionof the cassette support plate 72 aligns with the Y direction. After therotation of the cassette support plate 72, the carrying unit CRUperforms a positioning operation of the cassette carrying device CC sothat the X-direction position of the standby position P1 set by theloading buffer mechanism BF1 of the substrate processing unit SPUoverlaps with the X-direction position of the loading cassette C1. Anyone of the rotation operation of the cassette support plate 72 and thepositioning operation of the cassette carrying device CC may beperformed first.

After the positioning operation (or the rotation operation), thecarrying unit CRU lifts the loading cassette C1 placed on the cassettesupport plate 72 by using the cassette holding member 74, and in thisstate, moves the cassette holding member 74 in a sliding manner in the−Y direction. When the loading cassette C1 is disposed at a positionoverlapping with the standby position P1 in a plan view, the carryingunit CRU moves the cassette holding member 74 in the −Z direction so asto place the loading cassette C1 at the standby position P1.

After the placing operation of the loading cassette C1, the carryingunit CRU cancels the holding force applied to the loading cassette C1and withdraws the cassette holding member 74 in the +Y direction.According to these operations, the loading cassette C1 transferred tothe cassette carrying device CC is carried to the substrate processingunit SPU.

An operation of carrying the unloading cassette C2 will be described.This carrying operation is performed by using the cassette carryingdevice CC used in the operation of carrying the loading cassette C1. Thecarrying unit CRU moves the cassette carrying device CC in the Xdirection up to a position adjacent to the substrate unloading unit ULU,and performs a positioning operation so as to overlap with the positionof the unloading cassette C2 in the X direction. Then, the carrying unitCRU performs a transfer operation of the unloading cassette C2 disposedon the farthest +Y direction side inside the substrate unloading unitULU. The transfer operation is the same as that of the loading cassetteC1. After the transfer operation, the supply belt 61 a is moved so thatthe rest of the unloading cassettes C2 move together in the +Ydirection. Since the space of the −Y-direction-side end portion on thesupply belt 61 a is empty in accordance with the movement of theunloading cassette C2, a new unloading cassette C2 is supplied to theempty space by a supply mechanism (not shown).

After the transfer operation of the unloading cassette C2, the carryingunit CRU moves the cassette carrying device CC in the −X directiontoward the unloading buffer mechanism BF2, and rotates the cassettesupport plate 72 so that the longitudinal direction of the cassettesupport plate 72 aligns with the Y direction. After the rotation of thecassette support plate 72, the carrying unit CRU performs a positioningoperation of the cassette carrying device CC so that the X-directionposition of the standby position P5 set by the unloading buffermechanism BF2 of the substrate processing unit SPU overlaps with theX-direction position of the unloading cassette C2.

After the positioning operation, the carrying unit CRU places theunloading cassette C2 placed on the cassette support plate 72 at thestandby position P5, cancels the holding force applied to the unloadingcassette C2, and then withdraws the cassette holding member 74 in the +Ydirection. The placing operation and the withdrawing operation are thesame as those of the loading cassette C1. According to these operations,the unloading cassette C2 transferred to the cassette carrying device CCis carried to the substrate processing unit SPU.

Substrate Processing Operation

Next, a processing operation of the substrate processing unit SPU willbe described.

The substrate processing unit SPU performs a moving operation of movingthe loading cassette C1 accommodating the unprocessed substrate S andthe empty unloading cassette C2, a loading operation of loading thesubstrate S accommodated in the loading cassette C1, a coating operationof coating a liquid material on the substrate S, a peripheral edgeremoving operation of removing the peripheral edge of the thin filmformed on the substrate S, an unloading operation of unloading theprocessed substrate S, and a moving operation of moving the emptyloading cassette C1 and the unloading cassette C2 accommodating theprocessed substrate S. In addition to the respective operations, thecarrying operation of carrying the substrate S is performed between theloading operation and the coating operation, between the coatingoperation and the peripheral edge removing operation, and between theshape forming operation and the unloading operation.

Among these operations, first, the moving operation of the loadingcassette C1 and the unloading cassette C2 will be described. Thesubstrate processing unit SPU moves the loading cassette C1 carried tothe standby position P1 of the loading buffer mechanism BF1 to thestandby position P2 by using the conveyor belt 20 a, and further movesthe loading cassette C1 moved to the standby position P2 to the standbyposition P4 by using the conveyor belt 20 b. In the same manner, thesubstrate processing unit SPU moves the unloading cassette C2 carried tothe standby position P5 of the unloading buffer mechanism BF2 to thestandby position P6 by using the conveyor belt 22 a, and further movesthe unloading cassette C2 moved to the standby position P6 to thestandby position P8 by using the conveyor belt 22 b. According to theseoperations, the loading cassette C1 and the unloading cassette C2carried to the substrate processing unit SPU are disposed at a processstart position.

Next, the loading operation of the substrate S will be described. Afterthe substrate processing unit SPU checks that the loading cassette C1 isdisposed at the standby position P4, the substrate processing unit SPUdisposes the substrate upper portion holding mechanism 23 at theclamping position and moves the elevating member 24 a of the substratelower portion holding mechanism 24 in the +Z direction. According to themovement, the clamping member 24 b mounted to the +Z-direction-side endportion of the elevating member 24 a comes into contact with the−Z-direction-side portion of one sheet of substrate S disposed on thefarthest −Y direction side among the substrate S accommodated in theloading cassette C1, and the −Z-direction-side portion of the substrateS is held by the clamping member 24 b.

After the −Z-direction-side portion of the substrate S is held, thesubstrate processing unit SPU moves further the elevating member 24 a inthe +Z direction in the held state of the substrate S. According to themovement, the substrate S is lifted in the +Z direction side by thesubstrate lower portion holding mechanism 24, the +Z-direction-sideportion of the substrate S comes into contact with the clamping member23 b of the substrate upper portion holding mechanism 23, and then the+Z-direction-side portion of the substrate S is held by the clampingmember 23 b. The substrate S is held by both clamping member 23 b of thesubstrate upper portion holding portion 23 and the clamping member 24 bof the substrate lower portion holding mechanism 24.

The substrate processing unit SPU simultaneously moves the elevatingmembers 23 a and 24 a in the +Z direction in the state where thesubstrate S is held by the clamping members 23 b and 24 b. The substrateprocessing unit SPU moves the elevating mechanisms 23 c and 24 c in aninterlocking manner so that the elevating members 23 a and 24 a move atthe same speed. The substrate S held by the clamping members 23 b and 24b moves in the +Z direction. When the substrate S is disposed at theloading position LP, the substrate processing unit SPU stops themovement of the elevating members 23 a and 24 a. In this manner, theloading operation of the substrate S is performed.

After the loading operation, the substrate processing unit SPU allowsthe holding portion 32 of the loading carrying device SC1 to access theloading position LP, and allows the substrate S disposed at the loadingposition LP to be held by the holding portion 32. When the holdingportion 32 accesses the loading position LP, the substrate processingunit SPU rotates the rotary table 30 b so that the front end surface 31b of the arm portion 31 faces the +Y direction, and drives the motordevice 35 a so that the arm portion 31 moves in the Y direction. Inaccordance with the movement of the arm portion 31, the holding portion32 mounted to the front end surface 31 b (see FIG. 4) of the arm portion31 accesses the loading position LP.

FIG. 12 is a sectional view showing the state where the holding portion32 accesses the loading position LP. FIG. 13 is a view showing the statein FIG. 12 when viewed from the substrate S, that is, the opposite sideof the holding portion 32. As shown in the drawings, when the holdingportion 32 accesses the loading position LP, the absorbing surface 36 eof the suction member 36 comes into contact with the substrate S, andthe blocking member 37 is fitted into the opening Sa of the substrate S.The blocking member 37 is disposed inside the opening Sa, and blocks apart of the opening Sa so as to form a gap 38 between itself and theopening Sa.

After the access of the holding portion 32, the substrate processingunit SPU operates the suction pump 34 a. By means of the operation ofthe suction pump 34 a, the inside of the groove portion 36 c issuctioned through the perforation holes 33 e and 36 d so that thepressure inside the groove portion 36 c becomes negative. Since thepressure inside the groove portion 36 c becomes negative, the substrateS and the blocking member 37 disposed on the groove portion 36 c arepulled toward the absorbing surface 36 e so that the substrate S isabsorbed to the absorbing surface 36 e and is held by the holdingportion 32 so as to be upright in the Z direction.

In the operation, since the absorbing surface 36 e of the suction member36 comes into contact with the inside of an unprocessed portion S2 ofthe substrate S, the substrate S is suctioned without having aninfluence on a processed portion S1 of the substrate S. Since a part ofthe groove portion 36 c protrudes from the opening Sa of the substrate Sso as to be suspended on the surface of the substrate S, it is possibleto reliably absorb the surface of the substrate S.

Even when the blocking member 37 is pulled toward the absorbing surface36 e, since a gap between the perforation hole 36 d and the engagementportion 37 b is in an open state, the suctioning operation is notdisturbed. Since the blocking member 37 blocks the center of the openingSa, the suctioning force efficiently acts on the substrate S comparedwith the case where the center is not blocked.

In the substrate processing unit SPU, after the substrate S is uprightlyheld by the holding portion 32, the holding force of the clampingmembers 23 b and 24 b is canceled so that the substrate S is held byonly the holding portion 32. In this state, the substrate processingunit SPU withdraws the clamping members 23 b and 24 b, of which theholding force is canceled, in the −Z direction. After the clampingmembers 23 b and 24 b are withdrawn, the substrate processing unit SPUrotates the rotary table 30 b of the loading carrying device SC1, andcarries the substrate S to a coating position inside the coating deviceCT. At this time, the substrate S is held by the holding portion 32 soas to be upright in the Z direction.

Next, the coating operation of coating the liquid material on thesubstrate S will be described. In the coating operation, the coatingdevice CT is used. The substrate processing unit SPU rotates thesubstrate S at a high speed in the state where the substrate is uprightin the Z direction, allows nozzles 52 provided in the coating device CTto access a coating area of the substrate S, and then ejects the liquidmaterial from the nozzles to the substrate S. In the embodiment, uponrotating the substrate S, the substrate S is held by the loadingcarrying device SC1 and the loading carrying device SC1 is used torotate the substrate S.

In detail, the substrate processing unit SPU operates the motor device33 a in the state where the substrate S is disposed at the coatingposition 50. When the rotary shaft member 33 b rotates by the operationof the motor device 33 a, the holding portion 32 supported to the rotaryshaft member 33 b rotates together with the rotary shaft member 33 b.According to this operation, the substrate S rotates while the substrateS is upright in the Z direction.

After the substrate S rotates in the state where the substrate S isupright in the Z direction, the substrate processing unit SPU allows thenozzle 52 on the +X and −X direction sides of the coating position 50 toaccess the substrate S, and ejects the liquid material from the nozzle52 to the front and rear surfaces of the substrate S. The ejected liquidmaterial equally spreads to the outer periphery of the substrate S bythe centrifugal force caused by the rotation, thereby forming a thinfilm on both surfaces of the substrate S.

Since the nozzles 52 are disposed on the −Z direction side of the rotaryaxis of the substrate S, the nozzles 52 are disposed without contactingwith the holding portion 32 and the arm portion 31. In addition, sincethe nozzles 52 eject the liquid material from the rotary axis of thesubstrate S to the outer periphery of the substrate S, the movement ofthe liquid material toward the center of the substrate S is suppressed.

In the liquid material ejected onto the substrate S, due to the rotationof the substrate S, some of the liquid material protrudes and flies fromthe substrate S, and is accommodated in an accommodation portion 53through an opening formed in a facing portion 53 a of the inner cup CP1.In the inside of the accommodation portion 53, due to the rotation ofthe substrate S, the stream of the liquid material and gas occurs in therotation direction. In accordance with the stream, the liquid materialand gas are discharged to a discharge path through a dischargingmechanism 54 connected to an outer cup CP2. The liquid material and gasdischarged to the discharge path are divided by a trap mechanism 55, sothat the gas passes through the trap mechanism 55 and the liquidmaterial remains in the trap mechanism 55. The liquid material remainingin the trap mechanism 55 is discharged through a discharge portion (notshown).

After the coating operation, the substrate processing unit SPU makes theholding portion 42 of the unloading carrying device SC2 access thesubstrate S inside the coating device CT from the +X direction, and theholding portion 42 holds the substrate S. The operation of holding thesubstrate S using the holding portion 42 is the same as that of the casewhere the substrate S is held by the holding portion 32. According tothis operation, one surface of the substrate S is held by the holdingportion 32 of the loading carrying device SC1 and the other surface ofthe substrate S is held by the holding portion 42 of the unloadingcarrying device SC2.

After the substrate S is held by the holding portion 42, the substrateprocessing unit SPU stops the operation of the suction pump 34 a so asto cancel the holding operation using the holding portion 32. Accordingto this operation, since the substrate S is held by only the holdingportion 42 of the unloading carrying device SC2, the substrate S isdelivered from the loading carrying device SC1 to the unloading carryingdevice SC2.

Next, the peripheral edge removing operation of removing the thin filmformed in the periphery of the substrate S will be described. In theperipheral edge removing operation, the peripheral edge removing deviceEBR is used. When the peripheral edge of the substrate S disposed insidethe peripheral edge removing device EBR is dipped in a solution insidethe dip portion and the substrate S rotates in this state, the thin filmof the peripheral edge dipped in the solution is dissolved and removed.In the embodiment, in the peripheral edge removing operation, uponrotating the substrate S, the substrate S is held by the unloadingcarrying device SC2 and the unloading carrying device SC2 is used torotate the substrate S. After the thin film of the peripheral edge isremoved, the substrate processing unit SPU moves the peripheral edge ofthe substrate S to a gap between suction pads 58 c of the suctionportion 58 b so as to suction the peripheral edge of the substrate S.According to the suctioning operation, the liquid material, thesolution, or the like remaining in the peripheral edge of the substrateS is removed.

In detail, after the delivery operation of the substrate S, thesubstrate processing unit SPU rotates a rotary table 40 b andappropriately expands or contracts an arm portion 41 so that the holdingportion 42 accesses the peripheral edge removing device EBR. After theaccess, the substrate processing unit SPU moves the arm portion 41 ormoves the dip portion so that the peripheral edge of the substrate S isdipped in the solution of the dip portion. In this state, the substrateprocessing unit SPU operates a motor device 43 a of the unloadingcarrying device SC2. When a rotary shaft member 43 b rotates by theoperation of the motor device 43 a, a suction member 46 supported to therotary shaft member 43 b moves together with the rotary shaft member 43b. According to the rotation, the thin film of the peripheral edge ofthe substrate S is removed.

After the peripheral edge removing operation, the substrate processingunit SPU moves the elevating member 25 a so that the clamping member 25b of the substrate upper portion holding mechanism 25 is located on the+Z direction side of the unloading position UP. After the movement ofthe elevating member 25 a, the substrate processing unit SPU rotates therotary table 40 b in the state where the substrate S is held by theholding portion 42 of the unloading carrying device SC2, andappropriately expands or contracts the arm portion 41 so that theholding portion 42 accesses the unloading position UP. According to thisoperation, the substrate S is disposed at the unloading position UP.

Next, the unloading operation of the substrate S will be described.After the substrate processing unit SPU checks that the substrate S isdisposed at the unloading position UP, the substrate processing unit SPUmoves the elevating member 25 a of the substrate upper portion holdingmechanism 25 in the −Z direction and the elevating member 26 a of thesubstrate lower portion holding mechanism 26 in the +Z direction.According to this movement, the clamping member 25 b mounted to the−Z-direction-side portion of the elevating member 25 a comes intocontact with the +Z-direction-side portion of the substrate S, and theclamping member 26 b mounted to the +Z-direction-side end portion of theelevating member 26 a comes into contact with the −Z-direction-sideportion of the substrate S so that the +Z-direction-side portion and the−Z-direction-side portion of the substrate S are respectively held bythe clamping members 25 b and 26 b.

After the substrate processing unit SPU checks that the substrate S isheld by both the clamping members 25 b and 26 b, the substrateprocessing unit SPU stops the operation of the suction pump 44 a of theunloading carrying device SC2 so as to cancel the operation of holdingthe substrate S using the holding portion 42. According to thisoperation, the substrate S is held by only the clamping members 25 b and26 b. The substrate processing unit SPU simultaneously moves theelevating members 25 a and 26 a in the −Z direction in the state wherethe substrate S is held by the clamping members 25 b and 26 b. Thesubstrate processing unit SPU moves the elevating mechanisms 25 c and 26c in an interlocking manner so that the elevating members 25 a and 26 amove at the same speed. The substrate S is moved in the −Z direction inthe state where the substrate S is held by the clamping members 25 b and26 b.

When the protrusion of the elevating member 25 a approaches theunloading cassette C2, the substrate processing unit SPU cancels theholding force using the clamping member 25 b and stops the movement ofthe elevating member 25 a so that only the elevating member 26 a movesin the −Z direction. The substrate S is moved in the −Z direction in thestate where the substrate S is held by the holding force using theclamping member 26 b.

The substrate processing unit SPU maintains the operation of holding thesubstrate S using the clamping member 26 b until the substrate S arrivesat the accommodation position inside the unloading cassette C2. Afterthe substrate S arrives at the accommodation position, the substrateprocessing unit SPU cancels the holding operation using the clampingmember 26 b, and moves the elevating member 26 a in the −Z direction.According to this operation, the substrate S is accommodated in theunloading cassette C2.

In the description of the respective operations, the respectiveoperations are sequentially performed on one sheet of substrate Saccommodated on the farthest −Y direction side of the loading cassetteC1, but actually, the respective operations are continuously performedon plural substrates S. In this case, the substrate processing unit SPUrotates the conveyor belt 20 b and moves the loading cassette C1 in the−Y direction so that the substrate S disposed on the farthest −Ydirection side of the rest of the substrates S accommodated in theloading cassette C1 is disposed at a position overlapping with theloading position LP in a plan view.

In the same manner, the substrate processing unit SPU rotates theconveyor belt 22 b and moves the unloading cassette C2 in the −Ydirection so that the accommodation position on the farthest −Ydirection side of the accommodation positions inside the unloadingcassette C2 is disposed at a position overlapping with the unloadingposition UP in a plan view. When the substrate processing unit SPU movesthe loading cassette C1 and the unloading cassette C2, the substrateprocessing unit SPU repeats the above-described operations.

In the case where plural substrates S are processed, the substrateprocessing unit SPU simultaneously performs the processing operations onthe plural substrates S. In detail, during the time when the coatingoperation is performed on a certain substrate S, the peripheral edgeremoving operation is performed on the other substrate S. In addition,the loading operation or the unloading operation is performed on anothersubstrate S. In this manner, the operations are simultaneously performedon the plural substrates S. Thus, since the process operations aresimultaneously performed, the standby time of the substrate S is reducedas much as possible, and hence the process tact time of the substrate Sis reduced.

In the case where the processes of all the substrates S accommodated inthe loading cassette C1 end, the loading cassette C1 is empty, and allaccommodation positions of the unloading cassette C2 staying at thestandby position P8 are filled with the processed substrates S. Afterthe substrate processing unit SPU checks this state, the substrateprocessing unit SPU moves the loading cassette C1 from the standbyposition P4 to the standby position P2 by rotating the conveyor belt 20b in the inverse direction, and moves the loading cassette C1 to thestandby position P3 by rotating the conveyor belt 20 a. In the samemanner, the substrate processing unit SPU moves the unloading cassetteC2 from the standby position P8 to the standby position P6 by rotatingthe conveyor belt 22 b in the inverse direction, and moves the unloadingcassette C2 to the standby position P7 by rotating the conveyor belt 22a.

Next, a maintenance operation of a nozzle portion NZ and a cup portionCP of the coating device CT will be described. When the coatingoperation is repeated, solidified materials such as a liquid material orimpurities such as chip or dust in the atmosphere may be adhered to thenozzle portion NZ or the cup portion CP. The impurities may block, forexample, the nozzles 52 to thereby deteriorate the ejectingcharacteristic thereof or may block the discharge path inside the cupportion CP. In addition, in the ejecting operation, it is necessary toconstantly manage the ejecting condition of the nozzles 52. Accordingly,it is necessary to periodically perform the maintenance operation of thenozzle portion NZ and the cup portion CP.

In the maintenance operation of the nozzle portion NZ, a nozzle managingmechanism NM is used. Upon cleaning the nozzles 52, the substrateprocessing unit SPU moves the nozzle portion NZ so that the nozzlemanaging mechanism NM accesses the nozzles 52. The substrate processingunit SPU cleans the front end of each nozzle 52 by moving the front endof the nozzles 52 in the cleaning liquid of a cleaning portion 57 a.

After the cleaning operation, the substrate processing unit SPU movesthe front end of the nozzle 52 to a gap between the suction pads 57 d ofthe suction portion 57 b, and suctions the front end of the nozzle 52.According to the suctioning operation, impurities such as the cleaningliquid remaining in the nozzle 52 are removed.

After the suctioning operation, the substrate processing unit SPU movesthe front end of the nozzle 52 to the inside of a liquid receivingportion 57 c. In the liquid receiving portion 57 c, a preliminaryejecting operation of the nozzle 52 is performed. By preliminarilydischarging the liquid material from the nozzle 52, the ejectingcondition of the nozzle 52 is adjusted. After the substrate processingunit SPU moves the front end of the nozzle 52 to the inside of theliquid receiving portion 57 c, the substrate processing unit SPU ejectsthe liquid material from the nozzle 52. The ejected liquid material iscollected in the liquid receiving portion 57 c, and is collected by acollecting mechanism (not shown).

The maintenance operation of the cup portion CP will be described. Uponcleaning the cup portion CP, cleaning liquid nozzle portions 56 areused. Upon performing the coating operation, the substrate processingunit SPU allows the cleaning liquid nozzle portions 56 instead of thenozzles 52 to access the +X-direction-side portion and the−X-direction-side portion of the substrate S while the substrate Srotates, and ejects the cleaning liquid from the cleaning liquid nozzleportions 56 to the substrate S. The cleaning liquid ejected onto thesubstrate S moves to the peripheral edge of the substrate S by thecentrifugal force caused by the rotation, and flies from the peripheraledge of the substrate S to the inner cup CP1. The flying cleaning liquidis accommodated in the accommodation portion 53 through the opening ofthe facing portion 53 a. At this time, in the substrate processing unitSPU, since the substrate S rotates, it is possible to cause a stream ofthe cleaning liquid inside the accommodation portion 53. Accordingly, itis possible to clean the inside of the accommodation portion 53 and theinside of the discharge path by the stream of the cleaning liquid. As inthe case of discharging the liquid material, the cleaning liquid isdivided by the trap mechanism 55 so as to be discharged separately froma gas.

The cleaning operation of the cup portion CP may be performed, forexample, in the state where the facing portion 53 a of the accommodationportion 53 is separated. Even in the case where the cleaning operationis not performed, for example, the facing portion 53 a may be separatedso as to separately clean the facing portion 53 a, or the facing portion53 a may be separated so as to perform the maintenance operation ofother portions of the cup portion CP.

Cassette Carrying Operation

Next, the cassette carrying operation in which the empty loadingcassette C1 is carried to the substrate loading unit LDU and theunloading cassette C2 accommodating the processed substrate S is carriedto the substrate unloading unit ULU will be described.

The operation of carrying the loading cassette C1 will be described. Thecarrying operation is performed by using the cassette carrying device CCused in the above-described carrying operation. The carrying unit CRUmoves the cassette carrying device CC up to the loading buffer mechanismBF1 of the substrate processing unit SPU. The empty loading cassette C1stays in a standby state at the standby position P3 inside the loadingbuffer mechanism BF1. The carrying unit CRU rotates the cassette supportplate 72 so that the longitudinal direction of the cassette supportplate 72 of the cassette carrying device CC aligns with the longitudinaldirection of the loading cassette C1.

After the rotation of the cassette support plate 72, the carrying unitCRU performs a positioning operation between the X-direction position ofthe cassette carrying device CC and the X-direction position of theloading cassette C1. After the positioning operation, the carrying unitCRU allows the cassette carrying device CC to perform the transferoperation of the empty loading cassette C1 staying in a standby state atthe standby position P3. The transfer operation is the same as theabove-described transfer operation.

After the transfer operation of the loading cassette C1, the carryingunit CRU moves the cassette carrying device CC in the −X directiontoward the substrate loading unit LDU, and rotates the cassette supportplate 72 so that the longitudinal direction of the cassette supportplate 72 aligns with the X direction. After the carrying unit CRUrotates the cassette support plate 72, the carrying unit CRU performs apositioning operation between the X-direction position of the cassettecarrying device CC and the X-direction position of the collection belt11 b provided in the substrate loading unit LDU.

After the positioning operation, the carrying unit CRU places the emptyloading cassette C1 placed on the cassette support plate 72 on the+Y-direction-side end portion of the collection belt 11 b, and withdrawsthe cassette holding member 74 in the +Y direction. The placingoperation and the withdrawing operation are the same as theabove-described placing operation and the above-described withdrawingoperation. According to theses operations, the loading cassette C1transferred to the cassette carrying device CC is carried to thesubstrate carrying unit LDU.

The operation of carrying the unloading cassette C2 will be described.As in the carrying operation of the loading cassette C1, the carryingoperation is performed by using the cassette carrying device CC. Thecarrying unit CRU moves the cassette carrying device CC in the Xdirection up to the unloading buffer mechanism BF2 of the substrateprocessing unit SPU. The unloading cassette C2 accommodating theprocessed substrate S stays in a standby state at the standby positionP7 inside the unloading buffer mechanism BF2. The carrying unit CRUrotates the cassette support plate 72 so that the longitudinal directionof the cassette support plate 72 of the cassette carrying device CCaligns with the longitudinal direction of the unloading cassette C2.

After the rotation of the cassette support plate 72, the carrying unitCRU performs a positioning operation of the cassette carrying device CCso that the X-direction position of the cassette carrying device CC isequal to the X-direction position of the unloading cassette C2. Afterthe positioning operation, the carrying unit CRU makes the cassettecarrying device CC perform the transfer operation of the unloadingcassette C2 staying in a standby state at the standby position P7. Thetransfer operation is the same as the transfer operation.

After the transfer operation, the carrying unit CRU moves the cassettecarrying device CC in the +X direction toward the substrate unloadingunit ULU, and rotates the cassette support plate 72 so that thelongitudinal direction of the cassette support plate 72 aligns with theX direction. After the carrying unit CRU rotates the cassette supportplate 72, the carrying unit CRU performs a positioning operation betweenthe X-direction position of the cassette carrying device CC and theX-direction position of the collection belt 61 b provided in thesubstrate unloading unit ULU.

After the positioning operation, the carrying unit CRU places theunloading cassette C2 placed on the cassette support plate 72 on the+Y-direction-side end portion of the collection belt 61 b, and withdrawsthe cassette holding member 74 in the +Y direction. The placingoperation and the withdrawing operation are the same as theabove-described placing operation and the above-described withdrawingoperation. According to these operations, the unloading cassette C2transferred to the cassette carrying device CC is carried to thesubstrate unloading unit ULU.

Cassette Collecting Operation

Next, a cassette collecting operation of collecting the empty loadingcassette C1 and the unloading cassette C2 accommodating the processedsubstrate S will be described.

After the substrate loading unit LDU checks that the empty loadingcassette C1 is carried thereto, the substrate loading unit LDU moves theloading cassette C1 in the −Y direction by rotating the collecting belt11 b. During the movement in the −Y direction, for example, the loadingcassette C1 may be moved straight to the cassette entrance 10, or theloading cassette C1 may be moved gradually by an amount in which the+Y-direction-side end portion of the collection belt 11 b is empty.

In the case where the loading cassette C1 is moved straight to thecassette entrance 10, the loading cassette C1 is carried to the outsideof the substrate loading unit LDU through the cassette entrance 10. Theloading cassette C1 carried to the outside of the substrate loading unitLDU is collected by a collecting mechanism (not shown). Whenever theloading cassette C1 is carried to the substrate loading unit LDU, thisoperation is repeated.

In the case where the loading cassette C1 is gradually moved, forexample, whenever the loading cassette C1 is carried to the substrateloading unit LDU, the loading cassette C1 may be moved so as to bedeviated in the −Y direction by an amount corresponding to a space ofone loading cassette C1. In the case where the loading cassette C1disposed on the farthest −Y direction side arrives at the cassetteentrance 10 by repeating the operation plural times, the collectingoperation is performed by a collecting mechanism (not shown).

On the other hand, after the substrate unloading unit ULU checks thatthe unloading cassette C2 accommodating the processed substrate S iscarried thereto, the substrate unloading unit ULU moves the unloadingcassette C2 in the −Y direction by rotating the collection belt 61 b.During the movement, as in the case of the substrate loading unit LDU,the unloading cassette C2 may be moved straight to the cassette entrance60, or may be moved so as to be gradually deviated in the −Y direction.According to the movement, finally, the unloading cassette C2 is carriedto the outside of the substrate unloading unit ULU through the cassetteentrance 60. The unloading cassette C2 carried to the outside of thesubstrate unloading unit ULU is collected by a collecting mechanism (notshown).

Cassette Supplement Operation

In the above description, during the time when the process operationsare performed by the substrate processing unit SPU, the loading cassetteC1 is disposed at the standby position P4 of the loading buffermechanism BF1, and the unloading cassette C2 is disposed at the standbyposition P8 of the unloading buffer mechanism BF2. At this time, thestandby position P1 of the loading buffer mechanism BF1 and the standbyposition P5 of the unloading buffer mechanism BF2 are empty.

After the carrying unit CRU checks that the standby positions P1 and P5are empty, the carrying unit CRU allows the cassette carrying device CCto carry the next loading cassette C1 and the unloading cassette C2 tothe standby positions P1 and P5, respectively. The carrying unit CRUfirst moves the cassette carrying device CC up to the substrate loadingunit LDU, and transfers the next loading cassette C1 thereto. After thetransfer operation, the carrying unit CRU moves the cassette carryingdevice CC up to the loading buffer mechanism BF 1, and places thetransferred loading cassette C1 to the standby position P1. In the samemanner, the carrying unit CRU moves the cassette carrying device CC tothe substrate unloading unit ULU, and transfers the next unloadingcassette C2 thereto. Then, the carrying unit CRU moves the cassettecarrying device CC to the unloading buffer mechanism BF2, and places theunloading cassette C2 to the standby position P5.

After the transfer operation of the loading cassette C1 and theunloading cassette C2, the substrate processing unit SPU allows theconveyor belts 20 a and 20 b to be in a standby state until the processoperations performed on the substrate S accommodated in the loadingcassette C1 at the standby position P4 substantially end. When theprocess operations end, the substrate processing unit SPU moves theloading cassette C1 from the standby position P4 to the standby positionP2 by rotating the conveyor belt 20 b.

According to this operation, the loading cassette C1 accommodating theunprocessed substrate S stays in a standby state at the standby positionP1, and the empty loading cassette C1 stays in a standby state at thestandby position P2. When the substrate processing unit SPU rotates theconveyor belt 20 a in this state, the loading cassette C1 at the standbyposition P2 moves to the standby position P3, and the loading cassetteC1 at the standby position P1 moves to the standby position P2. Thus,the moving operation is efficiently performed. Accordingly, actually, inthe case where the coating operation and the like are performed by thesubstrate processing unit SPU, it is desirable that the loadingcassettes C1 stay in a standby state at the standby positions P1 and P2.

In the same manner, if the conveyor belt 22 a is rotated when theunloading cassette C2 moves from the standby position P8 to the standbyposition P6, the unloading cassette C2 at the standby position P6 movesto the standby position P7, and the unloading cassette C2 at the standbyposition P5 moves to the standby position P6. Thus, even in theunloading buffer mechanism BF2, the moving operation is efficientlyperformed. Accordingly, actually, in the case where the coatingoperation and the like are performed by the substrate processing unitSPU, it is desirable that the unloading cassettes C2 stay in a standbystate at the standby positions P5 and P6.

When the loading cassette C1 moves from the standby position P1 to thestandby position P2, and the unloading cassette C2 moves from thestandby position P5 to the standby position P6, the standby positions P1and P5 are empty again. The next loading caste C1 and the next unloadingcassette C2 may stay at the empty standby positions P1 and P5,respectively. Thus, whenever the standby positions P1 and P5 of theloading buffer mechanism BF1 and the unloading buffer mechanism BF2 areempty, the carrying unit CRU carries the loading cassette C1 from thesubstrate loading unit LDU and carries the unloading cassette C2 fromthe substrate unloading unit LDU.

As described above, according to the embodiment, since the cassettecarrying device CC provided in the carrying unit CRU carries the loadingcassette C1 between the loading position LP and the substrate loadingunit LDU, and carries the unloading cassette C2 between the unloadingposition UP and the substrate unloading unit ULU, the carrying operationin different carrying areas can be performed by one cassette carryingdevice CC. For this reason, since the carrying process using thecassette carrying device CC can be unified, it is possible to simplifythe constitution of the substrate processing system SYS, and to reducethe process tact time. In addition, according to the embodiment, sincethe loading cassette C1 and the unloading cassette C2 are separatelyused, it is advantageous in that it is possible to prevent the substrateS from being contaminated.

In addition, according to the embodiment, since the substrate loadingunit LDU, the substrate processing unit SPU, and the substrate unloadingunit ULU are arranged in a linear direction, the carrying path betweenthe units can be set in the linear direction. Accordingly, it ispossible to prevent the carrying path from being complicated, and tosimplify the constitution of the substrate processing system SYS. Inaddition, according to the embodiment, since the substrate processingunit SPU is disposed between the substrate loading unit LDU and thesubstrate unloading unit ULU, the respective units are arranged in adirection along the stream of the carried substrate. Accordingly, it ispossible to improve the efficiency of the process.

Further, in the embodiment, since the carrying unit CRU moves thecassette carrying device CC in a linear direction (X direction), it ispossible to simplify the moving operation of the cassette carryingdevice CC. In addition, since plural cassette standby portions areprovided in the substrate loading unit LDU and the substrate unloadingunit ULU so that plural cassettes can stay in a standby state, it ispossible to promptly process more substrates.

Since the substrate loading unit LDU moves the cassette standby portionfor the loading cassette C1 to the carrying unit CRU by using the supplybelt 11 a and the collection belt 11 b and the substrate unloading unitULU moves the cassette standby portion for the unloading cassette C2 tothe cassette entrance 60 by using the supply belt 61 a and thecollection belt 61 b, it is possible to efficiently perform the supplyoperation and the collection operation of the loading cassette C1 andthe unloading cassette C2.

Since the substrate processing unit SPU is provided with the loadingbuffer mechanism BF1 corresponding to the loading position LP and theunloading buffer mechanism BF2 corresponding to the unloading positionUP, and plural cassettes C stay in a standby state at the buffermechanisms, it is possible to promptly perform the loading operation andthe unloading operation of the substrate S in the substrate processingunit SPU, and thus to improve the efficiency of the process. Inaddition, since the buffer mechanism BF includes the conveyor belts 20and 22 for moving the standby position of the cassette C so that thestandby position of the cassette C moves in accordance with the numberof the substrates S remaining inside the cassette C, it is possible toimprove the efficiency of the process. Since the standby positions areprovided along the carrying direction (X direction) using the cassettecarrying device CC, the distance between the cassette carrying device CCand each standby position is uniform. Since the distance is uniformlymaintained, the cassette carrying device CC easily accesses therespective standby positions.

Since the substrate processing unit SPU includes the substrate loadingmechanism 21 which lifts the substrate S from the loading cassette C1and disposes the substrate S at the loading position LP, it is possibleto promptly perform the substrate loading operation. In the same manner,since the substrate processing unit SPU includes the substrate unloadingmechanism 27, it is possible to promptly perform the unloading operationof the substrate S.

Since the cassette carrying device CC includes the rotary mechanismwhich rotates the direction of the cassette support plate 72, even whenthe carrying direction is different from the direction of the cassette,it is possible to smoothly perform the carrying operation and thedelivery operation. In addition, since the loading cassette C1 and theunloading cassette C2 are respectively provided with the engagementportions Cx, and the carrying device includes the cassette holdingmember 74 which engages with the engagement portion Cx so as to hold theloading cassette C1 and the unloading cassette C2, it is possible toreliably hold the loading cassette C1 and the unloading cassette C2.

Since the control unit CNU controls the carrying positions of theloading cassette C1 and the unloading cassette C2 in accordance with theprocess condition of the substrate S in the substrate processing unitSPU, it is possible to further efficiently perform the carryingoperation.

The technical scope of the invention is not limited to theabove-described embodiment, but may be appropriately modified intovarious forms without departing from the spirit of the invention.

In the above-described embodiment, the control unit CNU controls thecarrying positions of the loading cassette C1 and the unloading cassetteC2 in accordance with the process condition of the substrate S insidethe substrate processing unit SPU, but the invention is not limitedthereto. For example, during the overall operations of the substrateprocessing system SYS, the carrying positions may be controlled in thestate where the carrying positions of the loading cassette C1 and theunloading cassette C2 and the carrying timing thereof are determined inadvance.

In the above-described embodiment, the loading cassette C1 and theunloading cassette C2 are provided with the engagement portions Cx, andthe cassette carrying device CC allows the holding portion 74 a of thecassette holding member 74 to engage with the engagement portion Cx soas to hold the loading cassette C1 and the unloading cassette C2, butthe invention is not limited thereto. For example, the cassette holdingportion 74 may hold other portions such as a bottom portion of theloading cassette C1 and the unloading cassette C2.

In the above-described embodiment, the cassette carrying device CCincludes the rotary mechanism which rotates the direction of thecassette support plate 72, but the invention is not limited thereto. Forexample, the direction of the cassette support plate 72 may be fixed. Inthis case, in the substrate processing system SYS, the cassette C issupplied, collected, and moved in the state where the longitudinaldirection of the cassette C aligns with the longitudinal direction ofthe cassette support plate 72. Accordingly, it is possible to furthersimplify the operation of the cassette carrying device CC.

In the above-described embodiment, the substrate processing unit SPUincludes the substrate loading mechanism 21 which lifts the substrate Sfrom the loading cassette C1 and disposes the substrate S at the loadingposition LP, but the invention is not limited thereto. For example, thesubstrate loading mechanism 21 may have other constitutions. The sameapplies to the substrate unloading mechanism 27.

In the above-described embodiment, the buffer mechanism BF moves thestandby position of the cassette C in the X direction, but the inventionis not limited thereto. For example, the standby position of thecassette C may be moved in other directions. In addition, the standbyposition of the cassette C may be fixed.

In the above-described embodiment, the loading buffer mechanism BF1 andthe unloading buffer mechanism BF2 are provided as the buffer mechanismBF, but the invention is not limited thereto. For example, any one ofboth buffer mechanisms BF may be provided. The number of buffermechanisms BF is not limited, and the buffer mechanisms BF may beprovided at one position.

In the above-described embodiment, the cassette standby portion for theloading cassette C1 is moved to the carrying unit CRU by using thesupply belt 11 a and the collection belt 11 b, and the cassette standbyportion for the unloading cassette C2 is moved to the cassette entrance60 by using the supply belt 61 a and the collection belt 61 b, but theinvention is not limited thereto. For example, any one of the cassettestandby portions may be moved.

In the above-described embodiment, plural cassettes C stay in a standbystate at the substrate loading unit LDU and the substrate unloading unitULU, but the invention is not limited to thereto. For example, onecassette C may stay in a standby state at one unit. Accordingly, theinvention may be applied to even the small substrate processing systemSYS.

In the above-described embodiment, the carrying unit CRU moves thecassette carrying device CC in a linear direction (X direction), but theinvention is not limited thereto. For example, the cassette carryingdevice CC may be moved in other plural directions or a curve direction.

Thus, when the carrying direction is set to various shaped directionsinstead of the linear direction, it is possible to improve the degree offreedom in design related to the arrangements of the respective units.

For example, in the above-described embodiment, the substrate processingunit SPU is disposed between the substrate loading unit LDU and thesubstrate unloading unit ULU, but the substrate loading unit LDU, thesubstrate unloading unit ULU, and the substrate processing unit SPU maybe disposed at different positions.

In the above-described embodiment, the substrate processing unit SPU,the substrate loading unit LDU, and the substrate unloading unit ULU arearranged in a linear direction, but the invention is not limitedthereto. For example, the units may be respectively disposed at summitsof a rectangular triangle or a right triangle. That is, it is possibleto arrange the units in various ways.

In the above-described embodiment, the coating process forming a thinfilm on the substrate S is mainly exemplified as the process performedby the substrate processing unit SPU, but the invention is not limitedthereto. For example, a pre-process and a post-process of the coatingprocess may be performed by the substrate processing unit. As thepre-process, for example, a process of irradiating ultraviolet ray tothe substrate S, a process of cleaning the substrate S, and the like maybe exemplified. As the post-process, a process of depressurizing thevicinity of the substrate S, a process of heating the substrate S, andthe like may be exemplified.

In the above-described embodiment, the loading position LP and theunloading position UP are set in advance, and the substrate loadingmechanism 21 and the substrate unloading mechanism 27 are arranged inaccordance with the loading position LP and the unloading position UP.On the contrary, first, the positions of the substrate loading mechanism21 and the substrate unloading mechanism 27 may be set, and the loadingposition LP and the unloading position UP may be set on the +Z directionside of the substrate lower portion holding mechanisms 24 and 26.

Further, in the above-described embodiment, the coating device CT isconfigured to eject the liquid material onto the substrate S by rotatingthe substrate S, but the invention is not limited thereto. For example,the invention may be applied to other types of coating devices, forexample, a dipping coating device, a slit-nozzle coating device, or thelike. In addition, as the coating device CT, the invention is notlimited to a type in which a thin film is formed on one surface of thesubstrate S, but may adopt a type in which a thin film is formed on bothsurfaces of the substrate S.

According to the embodiment, since the holding portion 32 for suctioningand holding the substrate S is rotatable about the arm portion 31provided in the base portion 30, it is possible to rotate the substrateS in the state where the substrate S is held by the holding portion 32.For this reason, even when the substrate S is rotated in the substrateprocessing area such as the coating device CT, the peripheral edgeremoving device EBR, and the like, it is not necessary to perform thedelivery operation of the substrate S by between rotary mechanisms.Since a time required for the delivery operation of the substrate S isnot spent, it is possible to promptly perform a process including thecarrying operation of the substrate S and the process operation of thesubstrate S. Accordingly, it is possible to reduce the overall processtact time of the substrate processing system SYS, and thus to improvethe throughput. In the embodiment, since the rotary mechanism 33 forrotating the holding portion 32 is mounted to the arm portion 31, it ispossible to further decrease the size of the device.

According to the embodiment, in the case where the substrate S havingthe opening Sa is processed, since the groove portion 36 c suctions thesurface of the substrate S having the opening Sa, it is possible toobtain a wide process target area from the outer periphery of thesubstrate S to the portion suctioned by the groove portion 36 c. In theembodiment, since the groove portion 36 c is disposed so as to suctionthe unprocessed portion S2 of the substrate S, it is possible to suctionthe substrate S without having an influence on the processed portion S1of the substrate S.

According to the embodiment, since the holding portion 32 includes theblocking member 37 which is fitted into the opening Sa, at least a partof the opening Sa is blocked by the blocking member 37. Accordingly, itis possible to suction the substrate S without deteriorating thesuctioning force even when an area including the opening Sa issuctioned, and thus to reliably hold the substrate S.

According to the embodiment, since the blocking member 37 is separablymounted to other portions of the holding portion 32, for example, whenthe blocking member 37 is not necessary, it is possible to separate theblocking member 37 from the other portions. In addition, for example,since plural blocking members 37 having different dimensions can beseparately used, it is possible to handle the substrates S provided withopenings Sa having different dimensions. Accordingly, it is possible tovariously change the suctioning and holding type.

Further, according to the embodiment, since the thickness of theblocking portion 37 a of the blocking member 37 is not more than that ofthe substrate S, it is possible to prevent the blocking portion 37 afrom protruding to the opposite surface of the absorbing surface of thesubstrate S. Accordingly, it is easy to dispose other members on theopposite surface of the absorbing surface of the substrate S.

The technical scope of the invention is not limited to theabove-described embodiment, but may be appropriately modified intovarious forms without departing from the spirit of the invention.

For example, in the above-described embodiment, upon holding androtating the substrate S using the holding portion 32 in the coatingdevice CT, only one surface of the substrate S is held and rotated, butthe invention is not limited thereto. For example, both surfaces of thesubstrate S may be held and rotated.

FIG. 14 is a view showing a type in which both surfaces of the substrateS are held and rotated, and shows the inner constitution of the coatingdevice CT. As shown in the drawing, upon performing the coatingoperation, for example, a second holding portion 81 may be disposedinside the coating device CT so as to hold the opposite surface(hereinafter, referred to as the rear surface) of the surface of thesubstrate S held by the holding portion 32. In this constitution, thesecond holding portion 81 includes a contact portion 81 a and a shaftportion 81 b.

The contact portion 81 a includes a contact surface 81 c having the samedimension and shape as those of the absorbing surface 36 e of theholding portion 32. The contact surface 81 c is provided so as to comeinto contact with an area of the rear surface of the substrate Soverlapping with the absorbing surface 36 e. The shaft portion 81 b isprovided at the center of the contact portion 81 a, and is rotatablysupported by a support member (not shown). A pressing mechanism forpressing the shaft portion 81 b against the substrate S may beseparately provided.

In this constitution, when the substrate S rotates by the rotation ofthe holding portion 32, the rotation of the substrate S is transmittedto the second holding portion 81, and the second holding portion 81rotates in a following manner. Since it is possible to hold the samearea of the front and rear surfaces of the substrate S, it is possibleto reliably prevent the substrate S from coming off from the holdingportion 32 even when the substrate S is rotated. When the pressingmechanism is provided, it is possible to support both surfaces of thesubstrate S, and thus to further reliably prevent the substrate S fromcoming off therefrom.

FIG. 15 is a view showing another type in which both surfaces of thesubstrate S are held and rotated, and shows the inner constitution ofthe coating device CT. As shown in the drawing, a rotary holding portion82 may be provided inside the coating device CT so as to hold the rearsurface of the substrate S and to rotate itself whenever performing thecoating operation. In this constitution, the rotary holding portion 82includes a motor device 82 a and a rotary holding member 82 b.

The motor device 82 a is a device which applies the rotation force tothe rotary holding member 82 b, and has the same driving force as thatof the motor device 33 a of the holding portion 32. The RPMs of themotor devices 33 a and 82 a are controlled by the control unit CNU orthe like. The rotary holding member 82 b includes a contact portion 82 cand a shaft portion 82 d.

As in the contact portion 81 a shown in FIG. 14, the contact portion 82c includes a contact surface 82 e having the same dimension and shape asthose of the absorbing surface 36 e (see FIG. 7) of the holding portion32. The contact surface 82 e is provided so as to come into contact withan area of the rear surface of the substrate S overlapping with theabsorbing surface 36 e. The shaft portion 82 d is provided at the centerof the contact portion 82 c, and the end portion thereof is connected tothe motor device 82 a. A pressing mechanism for pressing the shaft 82 dagainst the substrate S may be separately provided.

In this constitution, both surfaces of the substrate S can be held bythe absorbing surface 36 e and the contact surface 82 e, the holdingportion 32 is rotated by driving the motor device 33 a, and the contactportion 82 c is rotated by the motor device 82 a so as to supply therotation driving force to both surfaces of the substrate S, therebyreducing a load of the motor device 33 a. When the pressing mechanism isprovided, since it is possible to support both surfaces of the substrateS and to rotate both surfaces thereof, it is possible to further improvethe rotation precision of the substrate S.

The constitution shown in FIGS. 14 and 15 is valid in the case ofperforming the coating operation inside the coating device CT, but theinvention is not limited thereto. For example, the constitution insidethe peripheral edge removing device EBR may be the same as theconstitution shown in FIGS. 14 and 15. Accordingly, even in theunloading carrying device SC2, in the same manner as described above, itis possible to further reliably prevent the substrate S from coming offfrom the holding portion and to prevent the load of the motor 43 a.

In the constitution shown in FIGS. 14 and 15, the absorbing surface 36 efor absorbing the substrate S and the contact surface 81 c of the secondholding portion 81 or the absorbing surface 36 e and the contact surface82 e of the rotary holding portion 82 are used to hold both surfaces ofthe overlapping portion of the substrate S, but the invention is notlimited thereto. For example, the front and rear surfaces of thesubstrate S may be held at different positions.

Further, in the constitution shown in FIGS. 14 and 15, the secondholding portion 81 and the rotary holding portion 82 are disposed insidethe coating device CT, but the invention is not limited thereto. Forexample, the second holding portion 81 and the rotary holding portion 82may be disposed outside the coating device CT so as to access the insideof the coating device CT as occasion demands.

In addition, the unloading carrying device SC2 may perform theabove-described operations in stead of the second holding portion 81 andthe rotary holding portion 82. In this case, it is possible to obtainthe same advantage as that of the second holding portion 81 by stoppingthe operation of the motor device 43 a of the unloading carrying deviceSC2. Further, it is possible to obtain the same advantage as that of therotary holding portion 82 by operating the motor device 43 a of theunloading carrying device SC2.

In the case where the unloading carrying device SC2 is used, since it isnot necessary to perform the operation of holding the substrate S usingthe unloading carrying device SC2 after the coating operation of thesubstrate S ends, it is possible to shorten the operation of deliveringthe substrate S from the loading carrying device SC1 to the unloadingcarrying device SC2. For this reason, it is possible to further reducethe process tact time, and thus to further improve the throughput.

As described, according to the embodiment, since it is possible to ejectthe liquid material from the nozzles 52 to both surfaces of thesubstrate S rotating in an upright state, it is possible to allow theliquid material coating conditions at the front and rear surfaces of thesubstrate S to be more similar to each other. Since the front and rearsurfaces of the substrate S are closer to the liquid material used tocoat the surfaces thereof, it is possible to prevent a difference in thestate of the thin film formed by the liquid material coated on thesubstrate S. Accordingly, it is possible to improve the state of theliquid material coated on the substrate S.

Regarding the nozzle portion NZ, when the nozzle 52 is configured toeject the liquid material from the center of the substrate S to theouter periphery thereof, the ejecting direction of the nozzle 52 isequal to the direction of the centrifugal force acting on the substrateS. Accordingly, it is possible to further efficiently apply the liquidmaterial. In the embodiment, since the nozzle 52 is bent from the centerthereof to the outer periphery thereof, it is possible to adjust theejecting direction of the liquid material with a simple constitutionwithout separately providing an adjusting mechanism or the like foradjusting the ejecting direction of the liquid material.

Since an ejecting surface 52 a of the front end of the nozzle 52 isinclined relative to the ejecting direction of the liquid material, itis possible to reduce the surface tension of the liquid material in thefront end of the nozzle 52. Accordingly, the liquid material hardlyremains in the front end of the nozzle 52. In addition, when the nozzle52 is provided below the rotary shaft of the substrate carryingmechanism SC, it is possible to allow the ejecting direction of theliquid material to align with the direction of gravity. Accordingly, theliquid material easily spreads on the substrate S.

When the nozzles 52 are disposed at the same positions of the front andrear surfaces of the substrate S, it is possible to allow the coatingconditions at the front and rear surfaces of the substrate S to be equalto each other. Accordingly, it is possible to uniformly apply the liquidmaterial on both surfaces of the substrate S. In addition, since themoving mechanism 51 for moving the nozzle 52 is provided, it is possibleto move the position of the nozzle 52 in accordance with the processcondition of the coating device CT. Accordingly, it is possible toperform the coating operation in a wider range.

Regarding the nozzle managing mechanism NM, since the nozzle managingmechanism NM includes the cleaning portion 57 a which cleans the frontend of the nozzle 52 by dipping the front end of the nozzle 52 in thecleaning liquid, it is possible to clean and remove the liquid materialadhered to the front end of the nozzle 52. When the liquid material isadhered to the front end of the nozzle 52, the nozzle 52 is blocked,which causes deterioration in the ejecting performance. In theinvention, it is possible to prevent the deterioration in the ejectingperformance by cleaning the front end of the nozzle 52. In addition,since the nozzle managing mechanism NM includes the suction portion 57 bwhich suctions the front end of the nozzle 52, it is possible to removethe liquid material adhered to the front end of the nozzle 52 or toremove the cleaning liquid or the like used to clean the liquid materialfrom the front end of the nozzle 52. Accordingly, it is possible tomanage the front end of the nozzle 52 in a cleaner state. In addition,since the nozzle managing mechanism NM includes the liquid receivingportion 57 c which receives the liquid material preliminarily ejectedfrom the nozzle 52, it is easy to perform the preliminary liquidmaterial ejecting operation. Accordingly, it is possible to prevent thedeterioration in the ejecting performance of the nozzle 52.

Regarding the cup portion CP, since the cup portion CP includes theaccommodation portion 53 which accommodates the liquid material, it ispossible to collect the flying liquid material in the accommodationportion 53. Accordingly, it is possible to efficiently manage the flyingliquid material. In addition, since the facing portion 53 a of the cupportion CP facing the side portion of the substrate S is separablymounted to other portions of the cup portion CP, it is easy to performthe maintenance of the cup portion CP. Accordingly, it is easy to cleanthe cup portion CP. In addition, since the adjusting mechanism 53 b foradjusting the opening dimension of the facing portion 53 a is provided,it is possible to flexibly handle the cases in which the coating processconditions such as the thickness of the substrate S or the flying degreeof the liquid material are different.

In addition, the cup portion CP may includes the inner cup CP1 and theouter cup CP2, and the inner cup CP1 may be provided with anaccommodation portion 53. When the accommodation portion 53 is connectedto the discharging mechanism 54 which discharges at least one of theliquid material and gas inside the accommodation portion 53, due to therotation of the substrate S, it is possible to discharge the liquidmaterial inside the accommodation portion 53 by using the dischargingmechanism 54 and to form a stream of the gas inside the accommodationportion 53. In addition, when the inner cup CP1 is formed in a circularshape and the discharging mechanism 54 is provided along the tangentialdirection of the outer periphery of the inner cup CP1, it is possible todischarge the liquid material along the rotation direction of thesubstrate S. When the trap mechanism 55 is disposed in the dischargepath of the discharging mechanism 54, it is easy to handle the liquidmaterial.

When a cleaning liquid nozzle portion 56 which ejects the cleaningliquid cleaning the cup portion CP to the substrate S is furtherprovided, it is possible to allow the cleaning liquid ejected onto thesubstrate S to fly to the accommodation portion 53 inside the inner cupCP1 by the rotation of the substrate S. Accordingly, it is possible toefficiently clean the cup portion CP.

Regarding the peripheral edge removing device EBR, when a removingportion 58 a which removes the liquid material by dipping the outerperiphery of the substrate S in the solution is provided, it is possibleto efficiently remove the liquid material coated on the outer periphery.In addition, when a suction portion 58 b which suctions the outerperiphery of the substrate S is provided, and it is possible to promptlyremove the liquid material or the solution adhered to the outerperiphery of the substrate S.

The technical scope of the invention is not limited to theabove-described embodiment, but may be appropriately modified intovarious forms without departing from the spirit of the invention.

For example, in the above-described embodiment, the nozzle portion 56 isprovided as the nozzle for ejecting the cleaning liquid used to cleanthe cup portion CP, but the invention is not limited thereto. Forexample, as the cleaning liquid nozzle, the nozzle 52 may be commonlyused. In this case, a changing mechanism (not shown) which changes thesupply source of the nozzle 52 to the liquid material or the cleaningliquid is provided. Accordingly, it is possible to efficiently performthe maintenance without complicating the constitution of the device.

In the above-described embodiment, the position of the nozzle portion NZis disposed on the −Z direction side of the rotary axis of the substrateS, and the liquid material is ejected along the direction of thegravity, but the invention is not limited thereto. For example, theposition of the nozzle portion NZ may be disposed on the +Z directionside of the rotary axis of the substrate S so as to eject the liquidmaterial in a direction opposite to the direction of the gravity.

In the above-described embodiment, the nozzle 52 is bent at a bentportion 52 b, but the invention is not limited thereto. For example, thenozzle 52 may be formed in a curved shape toward the −Z direction of therotary axis of the substrate S. In this case, it is possible to smoothlycommunicate the liquid material.

In the above-described embodiment, the nozzles 52 are disposed at thesame positions of the front and rear surfaces of the substrate S, butthe invention is not limited thereto. For example, the nozzles 52 may bedisposed at different positions of the front and rear surfaces thereof.For example, one of the nozzles 52 may be disposed on the −Z directionside of the rotary axis of the substrate S relative to the+X-direction-side portion of a coating position 50, and another nozzle52 may be disposed on the +Z direction side of the rotary axis of thesubstrate S relative to the −X-direction-side portion of the coatingposition 50. Of course, the arrangement in the +Z direction side may bechanged to the arrangement in the −Z direction side, and the arrangementin the −Z direction side may be changed to the arrangement in the +Zdirection side.

In the above-described embodiment, the nozzle managing mechanism NM isdisposed on the +Y direction side of the nozzle portion NZ, but theinvention is not limited thereto. The nozzle managing mechanism NM maybe disposed at a different position within a movable range of the nozzleportion NZ.

In the above-described embodiment, upon cleaning the inside of the cupportion CP, the cleaning liquid is ejected to the substrate S by usingthe cleaning liquid nozzle portion 56, but the invention is not limitedthereto. For example, a cleaning liquid ejecting substrate differentfrom the substrate S may be disposed at the coating position 50 so as toeject the cleaning liquid to the cleaning liquid ejecting substrate.Accordingly, it is possible to suppress the substrate S from being usedfor other purposes, instead of forming the thin film.

In the above-described embodiment, in the constitution of the peripheraledge removing mechanism EBR, the removing portion 58 a and the suctionportion 58 b are disposed in a direction perpendicular to the substratesurface of the substrate S, but the invention is not limited thereto.For example, as shown in FIG. 23, the removing portion 58 a and thesuction portion 58 b may be arranged on the substrate surface. In thisconstitution, it is possible to simultaneously dispose the peripheralportion of one sheet of substrate S inside the removing portion 58 a andthe suction portion 58 b. Accordingly, it is possible to remove andsuction the peripheral portion by rotating the substrate S, and thus toreduce the process tact time.

In the above-described embodiment, the arm portions 31 and 41 of thesubstrate carrying device SC are adapted to be movable in a directionparallel to the XY plane, but the invention is not limited thereto. Forexample, the arm portions 31 and 41 may be adapted to be movable in theZ direction. This constitution can be realized by disposing a separatedriving mechanism inside the arm portions 31 and 41. Accordingly, sincethe movable ranges of the arm portions 31 and 41 are widened, it ispossible to widen the access areas of the holding portions 32 and 42.Accordingly, it is possible to perform various operations.

In the above-described embodiment, the moving mechanism 35 for movingthe arm portions 31 and 41 or the rotary mechanism 33 for rotating theholding portions 32 and 42 are disposed inside the arm portions 31 and41, but the invention is not limited thereto. The moving mechanism 35 orthe rotary mechanism 33 may be disposed outside the arm portions 31 and41. Accordingly, it is possible to slim the arm portions 31 and 41, andthus to reduce the load during the substrate carrying operation.

In the above-described embodiment, the thickness of the blocking member37 is formed to be thinner than that of the substrate S, but theinvention is not limited thereto. The blocking member 37 may be formedso that the thickness of the blocking member 37 is equal to thethickness of the substrate S. Even in this case, it is possible toobtain the same advantage as that of the above-described embodiment.

In the above-described embodiment, the blocking member 37 is separablymounted to the suction member 36, but the invention is not limitedthereto. For example, the blocking member 37 may be incorporated intothe suction member 36. In this case, it is not necessary to perform aprocess of separating the blocking member 37 from the suction member 36.In addition, it may not be necessary to provide the blocking member 37.

In the above-described embodiment, the groove portion 36 c provided inthe absorbing surface 36 e of the absorbing portion 36 a is formed in across shape when viewed from the front side of the groove portion 36 c,but the invention is not limited thereto. That is, the groove portion 36c may be formed in other shapes. In this case, it is desirable that thegroove portion 36 c is disposed so as to overlap with the surface of thesubstrate S in the state where the suction surface 36 e comes intocontact with the substrate S. Accordingly, it is possible to reliablysuction the surface of the substrate S, and thus to improve theabsorbing precision.

In the above-described embodiment, the substrate carrying devices SC aredisposed at two positions of the substrate processing unit SPU, but theinvention is not limited thereto. For example, the substrate carryingdevice(s) SC may be disposed at one position, or may be disposed atthree or more positions.

In the above-described embodiment, the substrate loading unit LDUincludes the belt conveyor mechanism as the cassette moving mechanism11, but the invention is not limited thereto. Instead of the beltconveyor mechanism, for example, a hook member which holds theengagement portion Cx of the loading cassette C1 may be provided. Thehook member, for example, may have the same constitution as that of thecassette holding member 74 of the cassette carrying device CC. In thestate where the engagement portion Cx of the loading cassette C1 is heldby the hook member, the loading cassette C1 may be moved inside thesubstrate loading unit LDU. The hook member may be used as the cassettemoving mechanism 61 of the substrate unloading unit ULU. Instead of thehook member, for example, other carrying mechanisms such as a railmechanism, a linear motor, and an air cylinder may, of course, be used.

In the above-described embodiment, in the loading buffer mechanism BF1and the unloading buffer mechanism BF2, the conveyor belts 20 a, 20 b,22 a, and 22 b are used as the moving mechanism for moving the standbypositions of the loading cassette C1 and the unloading cassette C2, butthe invention is not limited thereto. For example, in the loading buffermechanism BF1, a moving mechanism may be provided which moves theloading cassette C1 in a sequential order of the standby positions P1,P2, P4, P2, and P3. Even in the buffer mechanism BF2, in the samemanner, a moving mechanism may be provided which moves the unloadingcassette C2 in a sequential order of the standby positions P5, P6, P8,P6, and P7.

The moving mechanism, for example, may include a hook member which holdsthe engagement portions Cx of the loading cassette C1 and the unloadingcassette C2. In the same manner as described above, for example, thehook member may have the same constitution as the cassette holdingmember 74 of the cassette carrying device CC.

In the above-described embodiment, the substrate carrying devices SC aredisposed at two positions inside the substrate processing unit SPU, butthe invention is not limited thereto. For example, the substratecarrying device(s) SC may be disposed at one position, or may bedisposed at three or more positions.

In the above-described embodiment, the cassette C accommodates thesubstrate S so as to be upright in the Z direction, and carries thesubstrate S in an upright state, but the invention is not limitedthereto. The cassette C may accommodate the substrate S in the statewhere the substrate surface of the substrate S is parallel to the XYplane, and may carry the substrate S in this state.

In the above-described embodiment, the loading carrying device SC1 andthe unloading carrying device SC2 are configured to individually holdand rotate the substrate S, but the invention is not limited thereto.For example, in the loading carrying device SC1 and the unloadingcarrying device SC2, both surfaces of one sheet of substrate S may beheld and rotated. In this case, one of the loading carrying device SC1and the unloading carrying device SC2 may rotate mainly, and the otherthereof may be rotated in the following manner. Alternatively, both theloading carrying device SC1 and the unloading carrying device SC2 mayrotate mainly. When both surfaces of the substrate S are held by theloading carrying device SC1 and the unloading carrying device SC2, it ispossible to allow the front and rear surfaces of the substrate S to bein the same state related to an air stream or the like as much aspossible. By adjusting the states of both surfaces of the substrate S,it is possible to prevent the difference in the quality of the filmcoated on both surfaces of the substrate S.

In the above-described embodiment, the peripheral edge removing deviceEBR is disposed on the side of only the unloading carrying device SC2,but the invention is not limited thereto. For example, the peripheraledge removing device EBR may be disposed on the side of the loadingcarrying device SC1 (a portion depicted by the dashed line in FIG. 1).With such a constitution, for example, the coating operation and theperipheral edge removing operation may be performed on both the loadingcarrying device SC1 and the unloading carrying device SC2.

For example, during the time when the coating operation is performed bythe loading carrying device SC1, the peripheral edge removing operationmay be performed by the unloading carrying device SC2. On the contrary,during the time when the peripheral edge removing operation is performedby the loading carrying device SC1, the coating operation may beperformed by the unloading carrying device SC2. Likewise, since it ispossible to perform the parallel process by allowing two substratecarrying devices SC to alternately access the coating device CT, it ispossible to efficiently perform the process operations, and thus tofurther reduce the process tact time.

In addition, as described above, in the case where one sheet ofsubstrate S is simultaneously held and rotated by each of the loadingcarrying device SC1 and the unloading carrying device SC2, theperipheral edge removing device EBR may be disposed inside the coatingdevice CT. With this constitution, the coating operation is performed inthe state where the substrate S is held and rotated by each of theloading carrying device SC1 and the unloading carrying device SC2, andthe peripheral edge removing operation is continuously performed afterthe coating operation. Accordingly, since the coating operation and theperipheral edge removing operation are performed by one device, it ispossible to improve the efficiency of the process. In addition, sincethe coating operation and the peripheral edge removing operation areperformed by one coating device CT, for example, after performing thecoating operation and the peripheral edge removing operation on onesheet of substrate S, the next substrate S to be processed can be loadedby the loading carrying device SC1 in the state where the one sheet ofsubstrate S is unloaded by the unloading carrying device SC2. Since itis possible to simultaneously perform the loading operation using theloading carrying device SC1 and the unloading operation using theunloading carrying device SC2, it is possible to efficiently perform theprocess operation.

In addition to the constitution of the above-described embodiment, thesubstrate processing system SYS, for example, may further include aforeign material detecting unit which detects a foreign materialexisting on the substrate S subjected to the coating process. When aforeign material is adhered to the substrate S subjected to the coatingprocess, the foreign material adhered portion of the substrate S may bedamaged upon performing the next process, for example, the imprintingprocess. On the contrary, when the foreign material detecting unit isfurther provided so as to detect whether the foreign material exists onthe substrate S subjected to the coating process, it is possible todetect the substrate S to which the foreign material is adhered.Accordingly, since it is possible to prevent the substrate S from beingused for the next imprinting process, it is possible to prevent thesubstrate S from being damaged.

In addition, in the case where the substrate processing system SYSincludes the foreign material detecting unit, the foreign materialdetecting unit may be disposed as a unit which is independent from thestage unit STU, the substrate processing unit SPU, the substrate loadingunit LDU, the substrate unloading unit ULU, and the carrying unit CRU.For example, the foreign material detecting unit may be disposed insidethe substrate processing unit SPU. Although it is desirable that theforeign material detection is performed before the substrate S subjectedto the coating process is accommodated in the unloading cassette C2, theforeign material detection may be, of course, performed in the statewhere the substrate S is accommodated in the unloading cassette C2. Inthe case where the foreign material detection is performed before thesubstrate S is accommodated in the unloading cassette C2, for example, acollecting mechanism may be provided which separately collects thesubstrate S in which a foreign material is detected and prevent thesubstrate S from being collected in the unloading cassette C2.

In the case where the peripheral edge removing device EBR is disposedinside the coating device CT, for example, a peripheral edge removingnozzle having the same shape as that of the nozzle used for coating theliquid material may be separately disposed inside the coating device CT,and the solution of the liquid material may be ejected from theperipheral edge removing nozzle. In addition, the solution nozzle may becommonly used with the cleaning liquid nozzle portion 56. In this case,the supply source of the solution is connected to the cleaning liquidnozzle portion 56, and one of the supply sources of the cleaning liquidand the solution is selected to eject the cleaning liquid or thesolution, thereby ejecting both the cleaning liquid and the solutionfrom the same cleaning liquid nozzle portion 56.

In the case where the solution is ejected from the cleaning liquidnozzle portion 56, for example, as shown in FIG. 24A, the control unitCNU ejects the solution from the cleaning liquid nozzle portion 56 at aposition T1 where the solution does not contact with the substrate S.Subsequently, as shown in FIG. 24B, the control unit CNU moves thecleaning liquid nozzle portion 56 to a position T2 where the solution isejected to the substrate S in the state where the solution is ejected,and ejects the solution to the peripheral edge of the substrate S at theejecting position T2. According to theses operations, it is possible toprevent the solution from flowing from the cleaning liquid nozzleportion 56 from flying to the center of the substrate S, and thus toimprove the precision of adjusting the coating state of the outerperiphery of the substrate S.

In addition, in the case where both surfaces of one substrate S are heldand rotated by the loading carrying device SC1 and the unloadingcarrying device SC2, for example, the loading carrying device SC1 maysuction the substrate S, and the unloading carrying device SC2 may pressthe substrate S.

FIGS. 16 to 18 are views showing the constitution of the coating deviceCT. The coating device CT includes the nozzle portion NZ, the cupportion CP, and the nozzle managing mechanism NM.

The nozzle portions NZ are provided so as to access the center in the Ydirection of the coating position 50 by using the nozzle movingmechanism 51. The nozzle portions NZ are respectively disposed on the +Xdirection side and the −X direction side of the coating position 50.Each nozzle portion NZ includes the nozzle 52 which ejects the liquidmaterial as a material forming the thin film onto the substrate S. Thenozzle 52 is bent at the bent portion 52 b so as to eject the liquidmaterial from the center of the substrate S to the outer peripherythereof when the nozzle accesses the coating position. The nozzle 52 isprovided on the −Z direction side of the rotary axis of the substrate S.

The nozzles 52 are disposed at the same positions of the front surface(+X direction side) and the rear surface (−X direction side) of thesubstrate S relative to the coating position 50 so as to be symmetric toeach other in the X direction.

As shown in FIG. 19, the ejecting surface 52 a of the front end of thenozzle 52 is inclined relative to the ejecting direction of the liquidmaterial. Since the front end of the nozzle 52 is sharp, for example, itis possible for the liquid material to neatly run out from the nozzleupon stopping the coating operation using the liquid material.

The cup portion CP includes the inner cup CP1 and the outer cup CP2. Theinner cup CP1 is formed in a circular shape when viewed in the Xdirection, and is disposed so as to surround the side portion of thesubstrate S disposed at the coating position 50. The outer cup CP2 isformed in a square shape when viewed in the X direction, and supportsthe outside portion of the inner cup CP1. The outer cup CP2 is fixed tothe upper surface of the stage unit STU through, for example, a supportmember or the like.

In the embodiment, the inner cup CP1 and the outer cup CP2 areintegrally formed with each other, but may, of course, be separated fromeach other.

The inner cup CP1 includes an accommodation portion 53 whichaccommodates the liquid material. The accommodation portion 53 isprovided with the discharging mechanism 54 which discharges at least oneof the liquid material and gas inside the accommodation portion 53. Thedischarging mechanism 54 is provided along the tangential direction ofthe outer periphery of the inner cup CP1 formed in a circular shape. Thedischarging mechanism 54 is connected to the accommodation portion 53 ofthe inner cup CP1 through the outer cup CP2. As shown in FIG. 17, forexample, the discharging mechanism 54 is provided in each of four edgesof the outer cup CP2, where the number of discharging mechanisms 54 isfour in total. As shown in FIG. 17, each discharging mechanism 54 isconnected to each discharge path. Each discharge path is provided withthe trap mechanism 55 which is a gas-liquid separating mechanism forseparating a gas and a liquid. In addition, the discharge path and thetrap mechanism 55 for other discharge mechanisms 54 shown in FIGS. 16 to18 are not shown in the drawing.

As the inlet of the accommodation portion 53, the facing portion 53 a ofthe inner cup CP1 facing the side portion of the substrate S isseparably mounted to other portions of the inner cup CP1. As shown inFIG. 20, the inner cup CP1 includes the adjusting mechanism 53 b whichadjusts the dimension of the opening of the facing portion 53 a. Forexample, it is possible to adjust the dimension of the opening by usingthe adjusting mechanism 53 b in accordance with the thickness of thesubstrate S or the bouncing state of the coating liquid. The−Y-direction-side portion of the nozzle 52 is provided with the cleaningliquid nozzle portion 56 which ejects the cleaning liquid of the cupportion CP to the substrate S.

The nozzle managing mechanism NM manages the nozzle 52 so that theejecting state thereof is uniform. As shown in FIG. 21, the nozzlemanaging mechanism NM includes the cleaning portion 57 a, the suctionportion 57 b, and the liquid receiving portion 57 c. The cleaningportion 57 a cleans the front end of the nozzle 52 by dipping the frontend in the solution. The suction portion 57 b includes the suction pads57 d which suction the front end of the nozzle 52. The suction pads 57 dare connected to a suction pump (not shown) or the like. The liquidreceiving portion 57 c is a portion which receives the liquid materialpreliminarily ejected from the nozzle 52.

The peripheral edge removing device EBR is provided at a position alongthe −Y-direction-side edge of the substrate processing unit SPU on the+X direction side of the coating device CT. The peripheral edge removingdevice EBR is a device which removes the thin film formed on theperipheral edge of the substrate S. It is desirable that the removingprocess using the peripheral edge removing device EBR is performed inthe state where the thin film formed on the substrate S is not dried.For this reason, it is desirable that the peripheral edge removingdevice EBR is disposed at a position capable of carrying the substrate Sfrom the coating device CT in a short time. As shown in FIG. 22, theperipheral edge removing device EBR includes the removing portion 58 aand the suction portion 58 b. The removing portion 58 a is, for example,a portion which removes the thin film formed on the peripheral edge ofthe substrate S in such a manner that the peripheral edge of thesubstrate S is dipped in the solution by rotating the substrate S so asto melt and remove the thin film formed on the peripheral edge of thesubstrate S. The suction portion 58 b includes the suction pads 58 cwhich suction the peripheral edge of the substrate S. The suction pads58 c are connected to a suction pump (not shown) or the like.

In the method of rotating the substrate S in FIG. 16, for example, thesubstrate processing unit SPU inserts the substrate S held by theholding portion 32 of the loading carrying device SC1 into the cupportion CP, and allows the holding portion 42 of the unloading carryingdevice SC2 to press the substrate S from the opposite side of theholding portion 32. In more detail, the front end of the holding portion42 is allowed to move to the substrate S. The substrate processing unitSPU determines that the front end of the holding portion 42 contactswith the substrate S when the stroke of the holding portion 42 is equalto a predetermined threshold value.

After this determination, the substrate processing unit SPU cancels theoperation absorbing the substrate S using the holding portion 32 in thestate where the pressing force applied from the holding portion 42 ismaintained. After the absorbing operation is canceled, the substrateprocessing unit SPU inserts the nozzle 52 into the cup portion CP, andstarts the coating operation by rotating the substrate S. As seen above,the absorbing operation using the holding portion 32 may be canceledbefore rotating the substrate S.

In addition, after the determination, the substrate processing unit SPUallows the holding portion 32 to suction the substrate S and applies therotation force to the substrate S in the state where the substrate S ispressed by the holding portion 42. After the rotation of the substrate Sis changed from the accelerated rotation to the normal rotation, thesubstrate processing unit SPU cancels the operation of absorbing thesubstrate S using the holding portion 32. As seen above, the absorbingoperation using the holding portion 32 may be canceled during therotation of the substrate S.

In addition, after the determination, the substrate processing unit SPUrotates the holding portions 32 and 42 in the state where the substrateS is absorbed by the holding portion 32, and starts the coatingoperation. After the coating operation ends, the substrate processingunit SPU cancels the operation of absorbing the substrate S using theholding portion 32 in the state where the substrate S rotates. After theabsorbing operation is canceled, the substrate processing unit SPUperforms the rotation of the substrate S for a predetermined amount oftime. As seen above, after the coating operation ends, the absorbingoperation using the holding portion 32 may be canceled while thesubstrate S rotates.

In these cases, the substrate S is absorbed by the holding portion 32 ofthe loading carrying device SC1 and the substrate S is pressed by theholding portion 42 of the unloading carrying device SC2, but theinvention is not limited thereto. For example, the substrate S may bepressed by the holding portion 32 of the loading carrying device SC1 andthe substrate S may be absorbed by the holding portion 42 of theunloading carrying device SC2. Further, both surfaces of the substrate Smay be absorbed or pressed by the holding portion 32 of the loadingcarrying device SC1 and the holding portion 42 of the unloading carryingdevice SC2. Furthermore, in the case where the substrate S is held bythe second holding portion 81 shown in FIG. 14 or the rotary holdingportion 82 shown in FIG. 15, the substrate S may be rotated by using theabove-described method.

In addition, in these cases, upon rotating the substrate S, one of orboth the loading carrying device SC1 and the unloading carrying deviceSC2 may be driven. In the case where both the loading carrying deviceSC1 and the unloading carrying device SC2 are driven in a synchronizedmanner, since the substrate S is resistant to slip on the holdingportions 32 and 42, it is possible to reduce the pressing force appliedto the substrate S.

While preferred embodiments of the invention have been described andillustrated above, it should be understood that these are exemplary ofthe invention and are not to be considered as limiting. Additions,omissions, substitutions, and other modifications can be made withoutdeparting from the spirit or scope of the present invention.Accordingly, the invention is not to be considered as being limited bythe foregoing description, and is only limited by the scope of theappended claims.

What is claimed is:
 1. A carrying device which carries a substratebetween a substrate loading area, a substrate unloading area, and asubstrate processing area, the carrying device comprising: an armportion which is provided in an arm base portion, wherein the armportion extends along a horizontal plane; a base portion connected tosaid arm base portion; and a suction portion which is provided to berotatable about a major axis of the arm portion and is configured tosuction and hold a major surface of the substrate in a state where themajor surface of the substrate extends along a vertical planeperpendicular to the horizontal, wherein said arm portion has a rotatingmechanism for rotating said arm, wherein said horizontal plane with saidbase portion is perpendicular to said arm portion.
 2. The carryingdevice according to claim 1, wherein the substrate is a substrateprovided with an opening, and wherein the suction portion includes asuction hole which suctions a surface of the substrate along theopening.
 3. The carrying device according to claim 2, wherein thesuction hole is disposed so as to suction an unprocessed portion of thesubstrate.
 4. The carrying device according to claim 2, wherein thesuction portion includes a protrusion which is fitted into the opening.5. The carrying device according to claim 4, wherein the protrusion isprovided so as to be separable from other portions of the suctionportion.
 6. The carrying device according to claim 4, wherein aprotrusion amount of the protrusion is not more than a thickness of thesubstrate.
 7. The carrying device according to claim 1, wherein the armportion is equipped with a driving portion which rotates the suctionportion.
 8. The carrying device according to claim 1, furthercomprising: an external driving portion which rotates the substratewhile the substrate is being interposed between the external drivingportion and the suction portion.
 9. The carrying device according toclaim 8, wherein the external driving portion is provided in thesubstrate processing area.
 10. The carrying device according to claim 8,wherein the external driving portion includes a pressing portion whichpresses the substrate, and wherein the pressing portion is formed so asto correspond to the suction portion.
 11. The carrying device accordingto claim 10, wherein the external driving portion allows the pressingportion to press the substrate when the substrate is disposed at asubstrate processing position of the substrate processing area.
 12. Thecarrying device according to claim 11, further comprising: a controlportion which changes a suctioning state of the suction portion when thesubstrate is rotated by the external driving portion.
 13. The carryingdevice according to claim 12, wherein the control portion cancels thesuctioning operation using the suction portion before the substrate isrotated by the external driving portion.
 14. The carrying deviceaccording to claim 12, wherein the control portion cancels thesuctioning operation using the suction portion during the time when thesubstrate is rotated by the external driving portion.
 15. The carryingdevice according to claim 14, wherein the control portion cancels thesuctioning operation in accordance with the rotation state of thesubstrate.
 16. The carrying device according to claim 14, wherein thecontrol portion cancels the suctioning operation using the suctionportion after a predetermined process is performed on the substrate. 17.The carrying device according to claim 16, wherein the external drivingportion rotates the substrate even after the predetermined process. 18.The carrying device according to claim 1, wherein the arm portionincludes: a shaft portion which is rotatable about the base portion andis movable in a telescopic manner in a direction of a rotary axis of therotation; and a telescopic portion which is provided in the shaftportion and is movable in a telescopic manner in a directionperpendicular to the direction of the rotary axis, and wherein thesuction portion is provided in a front end of the telescopic portion.19. A method of carrying a substrate between a substrate loading area, asubstrate unloading area, and a substrate processing area, the methodcomprising: attaching a suction portion of a carrying device to thesubstrate such that the suction portion suctions and holds a majorsurface of the substrate in a state where the major surface of thesubstrate extends along a vertical plane perpendicular to the horizontalplane; lifting the substrate from the substrate loading area to disposethe substrate at a loading position; carrying the substrate to thesubstrate processing area; rotating the orientation of the carryingdevice so as to rotate the substrate; and carrying the substrate fromthe loading position to the substrate unloading area.